2022
DOI: 10.1108/hff-06-2021-0422
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Thermo-hydraulic and entropy generation investigation of nano-encapsulated phase change material (NEPCM) slurry in hybrid wavy microchannel

Abstract: Purpose This study aims to capture the heat transfer and entropy generation characteristics of temperature-dependent nano-encapsulated phase change material (NEPCM) slurry in a hybrid wavy microchannel. In addition, the effect of substrate material combined with NEPCM slurry on conjugate heat transfer condition is captured for different microchannel heat sinks. Design/methodology/approach A novel “hybrid wavy microchannel” is proposed to enhance the overall heat transfer and reduce the pressure drop by combi… Show more

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Cited by 25 publications
(8 citation statements)
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References 55 publications
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“…Compared to other channels, zigzag channels exhibited increased heat dissipation and higher pressure drop. Doshi et al (2022) proposed a hybrid wavy microchannel to improve heat dissipation and minimize the pressure drop using the combination of wavy and raccoon channels. They carried out numerical simulations and used nano-encapsulated phase change material (PCM) as the fluid to remove the heat.…”
Section: Introductionmentioning
confidence: 99%
“…Compared to other channels, zigzag channels exhibited increased heat dissipation and higher pressure drop. Doshi et al (2022) proposed a hybrid wavy microchannel to improve heat dissipation and minimize the pressure drop using the combination of wavy and raccoon channels. They carried out numerical simulations and used nano-encapsulated phase change material (PCM) as the fluid to remove the heat.…”
Section: Introductionmentioning
confidence: 99%
“…Golab et al (2021) used the finite volume method and SIMPLE algorithm to investigate natural convection inside a cavity for NEPCM nanoparticles in water. More investigations can be found in Sadeghi et al (2022), Mahmoud Aly et al (2022), Raizah and Aly (2021a, 2021b), Ghalambaz et al (2019a, 2019b), Ho et al (2020) and Doshi et al (2022).…”
Section: Introductionmentioning
confidence: 99%
“…Various cooling methods are presented for dissipating the heat from electronic devices, same as heat pipes (Rama Narasimha et al , 2010), forced air cooling, thermo-electric cooling (Koh et al , 2015) and liquid-cooling systems (Prajapati, 2019; Alihosseini et al , 2020). To improve the performance of cooling systems, modern research has shifted to liquid technologies such as microchannel/pin-fin heat sinks (PFHSs) (Doshi et al , 2022; Paramanandam and Srinivasan, 2022). Tuckerman and Pease (1981) introduced microchannel heat sinks for the first time to solve the heat transfer issues in 1981.…”
Section: Introductionmentioning
confidence: 99%