Thermally Stable Siloxane Hybrid Matrix with Low Dielectric Loss for Copper-Clad Laminates for High-Frequency Applications

Kim, Yong Ho; Lim, Young‐Woo; Kim, Yun Hyeok; Bae, Byeong‐Soo

doi:10.1021/acsami.6b01497

Cited by 58 publications

(31 citation statements)

References 25 publications

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“…The best k value (1.83 for c ‐T 12 B 12 ) obtained here is much lower than current state‐of‐the‐art low‐ k dielectric (i.e., porous SiCOH, k = 2.4) and recently reported low‐ k materials such as fluoropolymers, [ 18,65,66 ] modified polyimide, [ 19 ] MOFs, [ 25,26,67 ] and siloxane containing hybrid materials [ 17,68–70 ] (Table S3, Supporting Information). Although some porous organosilicas have extremely low‐ k values (≈1.7), [ 14,15 ] their further applications are limited by the inferior thermal stability (T d5 < 300 °C) and mesopore (too large pores will allow for metal diffusion through the dielectrics and result in short‐circuiting).…”

Section: Resultsmentioning

confidence: 57%

Polyhedral Oligomeric Silsesquioxanes Based Ultralow‐k Materials: The Effect of Cage Size

Zhou

Guo

et al. 2021

Adv Funct Materials

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Polyhedral oligomeric silsesquioxanes (POSS) are of considerable interest as building blocks for preparing low‐k materials. To date T8 POSS has been extensively investigated while the potential of larger POSS cages remain an unexplored area. Herein, the first known contribution to map the role of POSS cage size on the dielectric and other comprehensive properties of hybrid materials with identical chemical compositions is described. First, three vinyl POSS (T8, T10, and T12) species are isolated from a commercial POSS mixture. Then, they are converted to benzocyclobutene functionalized and thermo‐crosslinked hybrid materials. It is found that the cage size can strongly affect their k values, more importantly, showing a linear decrease while increasing the cage volumes (k = 2.24, 2.02, and 1.83 for c‐T8B8, c‐T10B10, and c‐T12B12, respectively). This finding highlights a profound influence of POSS cage changes on dielectric properties and could be used to predict ultralow‐k (1.5–1.1) materials by extrapolating to larger T14, T16, and T18 POSS cages. Meanwhile, varying the cage size has no obvious effect on the materials’ other properties, and all of them exhibit good comprehensive properties. Moreover, such low‐k values can persist at high temperature and high humidity conditions, which affords some promising (ultra)low‐k dielectrics for modern integrated circuit development.

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Section: Resultsmentioning

confidence: 57%

Polyhedral Oligomeric Silsesquioxanes Based Ultralow‐k Materials: The Effect of Cage Size

Zhou

Guo

et al. 2021

Adv Funct Materials

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“…With more TFDB content in the PIs, these polar imide groups are diluted by the increased CF 3 groups with a low molar polarizability and a low solubility parameter as caculated . Moreover, the rigid‐rod structure of TFDB, where the aromatic ring twists at a certain angle of 75.9–77.3°, leads to high relaxation time, resulting in a decrease in the dielectric permittivity . To better understand the change of ε under different composing structures, we also conducted a simulation of μ and α of the BU using DFT (M062X/6‐31+G(d)) as shown in Table .…”

Section: Resultsmentioning

confidence: 99%

Composition design and properties investigation of BPDA/PDA/TFDB co‐polyimide films with low dielectric permittivity

Lei

Guo

et al. 2019

J of Applied Polymer Sci

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Aiming at fabricating the polyimide (PI) films with low permittivity and excellent comprehensive properties, 2,2′‐bis‐(trifluoromethyl)‐4,4′‐diaminobiphenyl was incorporated into the polyimide backbone composed of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride and p‐phenylenediamine. The introduction of trifluoromethyl (CF3) groups led to a substantial reduction of the PI's permittivity (3.42–2.96). Meanwhile, as‐prepared co‐PI films showed excellent mechanical performance (217.13–238.20 MPa for strength and 3.49–4.90 GPa for modulus), as well as good thermal stability (high glass transition temperature over 354 °C, whereas low thermal expansion coefficient below 10 ppm/K). Structure–property relationship of the PI samples was further established through molecular simulations (MS), which suggested the crucial effects of polarizability per unit volume (α/Vvdw) and free volume on PI permittivity. The computational results were highly consistent with the experimental findings, meaning that MS technique is of guiding importance in copolymer design. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47989.

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“…Notably, the selection of the functional polymer groups is crucial to adjusting the chemical durability, thermal resistance, and degradability [6,7,8]. Methacrylate groups have the merits of fast curing by UV radiation, excellent optical transparency, and mechanical toughness [9,10,11,12]. Based on these advantageous properties, methacrylate resins are commonly used in cosmetics, adhesives, substrates, and hard coatings [13,14].…”

Section: Introductionmentioning

confidence: 99%

High-Performance and Simply-Synthesized Ladder-Like Structured Methacrylate Siloxane Hybrid Material for Flexible Hard Coating

et al. 2018

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A high performance ladder-like structured methacrylate siloxane hybrid material (LMSH) was fabricated via simple hydrolytic sol–gel reaction, followed by free-radical polymerization. A structurally ordered siloxane backbone, the ladder-like structure, which is an essential factor for high performance, could be achieved by a short period of sol–gel reaction in only 4 h. This results in superior optical (Transmittance > 90% at 550 nm), thermal (T5 wt % decomposition > 400 ℃), mechanical properties(elastic recovery = 0.86, hardness = 0.6 GPa) compared to the random- and even commercialized cage-structured silsesquioxane, which also has ordered structure. It was investigated that the fabricated ladder-like structured MSH showed the highest overall density of organic/inorganic co-networks that are originated from highly ordered siloxane network, along with high conversion rate of polymerizable methacrylate groups. Our findings suggest a potential of the ladder-like structured MSH as a powerful alternative for the methacrylate polysilsesquioxane, which can be applied to thermally stable and flexible optical coatings, even with an easier and simpler preparation process.

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Thermally Stable Siloxane Hybrid Matrix with Low Dielectric Loss for Copper-Clad Laminates for High-Frequency Applications

Cited by 58 publications

References 25 publications

Polyhedral Oligomeric Silsesquioxanes Based Ultralow‐k Materials: The Effect of Cage Size

Polyhedral Oligomeric Silsesquioxanes Based Ultralow‐k Materials: The Effect of Cage Size

Composition design and properties investigation of BPDA/PDA/TFDB co‐polyimide films with low dielectric permittivity

High-Performance and Simply-Synthesized Ladder-Like Structured Methacrylate Siloxane Hybrid Material for Flexible Hard Coating

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