2012
DOI: 10.1109/led.2012.2200230
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Thermally Stable Operation of H-Terminated Diamond FETs by $\hbox{NO}_{2}$ Adsorption and $\hbox{Al}_{2}\hbox{O}_{3}$ Passivation

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Cited by 66 publications
(43 citation statements)
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“…2 The fullerene molecule C 60 9 and its fluorinated variants C 60 15 achieving higher temperature operation. 16 Although this work has yielded very promising device performance, the exact mechanism that is responsible for the hole accumulation of diamond passivated by Al 2 O 3 is still a point of investigation. Similar work involving ALD deposition of Al 2 O 3 and HfO 2 has been explored for use in H-diamond MOSFETs.…”
mentioning
confidence: 98%
“…2 The fullerene molecule C 60 9 and its fluorinated variants C 60 15 achieving higher temperature operation. 16 Although this work has yielded very promising device performance, the exact mechanism that is responsible for the hole accumulation of diamond passivated by Al 2 O 3 is still a point of investigation. Similar work involving ALD deposition of Al 2 O 3 and HfO 2 has been explored for use in H-diamond MOSFETs.…”
mentioning
confidence: 98%
“…by atomic layer deposition (ALD) of Al 2 O 3 as passivation and gate insulator (12,13). The temperature effect on the HTD MOSFET up to 500K is measured and it opens the way to apply HTD devices in high-temperature environment.…”
mentioning
confidence: 99%
“…[5] From the CV measurement we estimate that the dielectric constant of the Al2O3 layer is 7.2 eV which is similar to values reported by other groups. [6] Interface trap analysis of the Al2O3 / hydrogenated diamond interface, correcting for series resistance of the contacts and access regions, [7] indicated good band bending efficiency [8] as shown in figure 4(a) and a higher trap density in the FET hydrogenated by an H2 environment anneal as shown in figure 4(b). These traps are shallow as indicated by the ionization energy level which is limited by the frequency of the CV meter.…”
Section: Discussionmentioning
confidence: 91%