“…There have been plenty of feasible methods to improve the thermal stability of PSCs. For instance, component engineering, additive incorporation, surface passivation, and process optimization are generally employed to improve the heat resistance of perovskite absorbers with substantially improved film quality and effective defect passivation . In addition, with regard to the carrier transport layer employing unstable organic materials, i.e., 2,2′,7,7′-tetrakis( N , N -di- p -methoxyphenylamine)-9,9′-spirobifluorene (spiro-OMeTAD), which has a poor thermal stability due to its low glass transition temperature, , researchers have found or synthesized a series of more thermally stable alternatives, such as poly(bis(4-phenyl)(2,4,6-trimethylphenyl)-amine) (PTAA), CuSCN, etc., to effectively prolong the lifetime of PSCs under thermal stressors.…”