2019
DOI: 10.1016/j.applthermaleng.2019.113991
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Thermally induced vibration and strength failure analysis of thermoelectric generators

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Cited by 19 publications
(4 citation statements)
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“…The lattice thermal conductivity and the bandgap are the same. The Seebeck coefficient for both n-and p-type materials is almost isotropic [16].…”
Section: Introductionmentioning
confidence: 99%
“…The lattice thermal conductivity and the bandgap are the same. The Seebeck coefficient for both n-and p-type materials is almost isotropic [16].…”
Section: Introductionmentioning
confidence: 99%
“…Mathematical modeling of the heat conduction is an important stage in the design of systems subjected to thermal loads, because it allows the appropriate selection of materials to avoid adverse phenomena related to the occurrence of thermal stresses. For example, the temperature distribution in the tested system may lead to the formation of thermal stresses, which may cause micro-cracks in the components of this system [ 1 , 2 , 3 ], and cyclical changes in the thermal load of the device may cause undesirable vibrations of the components of this device [ 4 , 5 , 6 ]. On the other hand, the heat source causing high temperature of biological tissue may destroy diseased tissue, but it may also damage healthy tissue [ 7 , 8 ].…”
Section: Introductionmentioning
confidence: 99%
“…The failure of thermoelectric devices is mainly due to the mismatched thermal expansion coefficients of different components. Various defects are caused by thermal stress, which reduce the lifespan of thermoelectric devices, causing their eventual failure [28]. Hence, it is necessary to research the thermal stress distribution of thermoelectric devices and find high stress locations within them.…”
Section: Introductionmentioning
confidence: 99%