This paper studies the transient interlaminar stress in a multilayered thermoelectric material (TEM), which consists of a N-type and a P-type thermocouple, separated by an insulating layer. Analytical solution for one-dimensional temperature and the associated interlaminar stresses at the steady-state and the transient state are obtained. The influence of insulating layer's thickness and material properties on the peeling stress, which is the key reason for delamination, has also been investigated. Distribution of the temperature and interlaminar stress are presented graphically. The interlaminar stress at the free ends of the TEM shows significant stress concentration. A thinner insulating layer results in a smaller interlaminar stress. The interlaminar stress also reduces if the insulting layer has a smaller Yo ung's modulus. The value of the transient interlaminar stress is found to be very different from that of the steady-state. Overall, the interlaminar stress level at the transient-state is higher than that at the steady-state.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.