Thermally curable adhesive tapes with complex catalyst system for fabricating semiconductor packages

Abstract

Thermal curing of adhesive films was investigated to facilitate the fabrication of a reliable bonding for semiconductors. The formulated adhesive films contained acrylic polymer, epoxy resins, phenol resin, and an imidazole derivative that was the catalyst for curing the epoxy resins with phenol resin. The solubility, thermally latent characteristics, mechanical and adhesive properties of 2-methylimidazole/boron trifluoride (2MZ/BF3), and 2MZ/aluminum trisacetylacetonate (AlAC) were investigated. It was found that 2MZ/BF3 and 2MZ/AlAC had excellent solubility in adhesive materials and they had excellent latent characteristics as thermal curing catalysts for epoxy resins, whereas conventional catalysts (2MZ and 2-phenyl-4, 5-dihydroxymethylimidazole (2PHZ)) could not achieve both excellent solubility and thermally latent characteristics. The mechanical and adhesive properties of the post-thermal-cured adhesive film that contained 2MZ/ BF3 or 2MZ/AlAC were comparable to those of the postthermal-cured adhesive films that contained conventional catalysts.

Preparation and properties of maleimide‐functionalized hyperbranched polysiloxane and its hybrids based on cyanate ester resin

“…It is known that high curing temperature not only causes high energy consumption, but also results in bigger internal stress and defects of the cured resin, and thereby declines the overall integrated properties of the resultant materials as well as applications, especially those with harsh requirements of outstanding overall properties 6. Generally, adding catalysts is a common method to improve the curing characteristics,7–13 while toughening is usually achieved by copolymerizing with other thermosetting resins, blending with engineering thermoplastics or rubbers, or introducing inorganic fillers 14–17. Each technique has made great progress; however, it is a common phenomenon that the addition of catalyst tends to enhance the brittleness 18.…”

Novel imidazole derivatives with recoverable activity as latent curing agents for epoxy

“…Latent curing agents can provide additional functions to epoxy by grafting special functional groups to them, such as, fire resistance, water resistance, or heat resistance. 5,[38][39][40] In this study, imidazole was designed as a latent curing agent by substituting the active hydrogen in secondary amine and also by restraining the reactivity of tertiary amine through steric effects. A series of polyethercontaining structures were designed for modifying imidazole, providing functional derivatives as latent curing agents and toughening agents.…”

“…A new method has been developed for toughening epoxy resins using multifunctional curing agents. Latent curing agents can provide additional functions to epoxy by grafting special functional groups to them, such as, fire resistance, water resistance, or heat resistance 5,38–40 …”

Study on reaction kinetics of epoxy resin cured by a modified dicyandiamide

“…Among frequently used curing agents, the latent curing agents have a long pot life in epoxy resin at ambient conditions, whereas they can cure epoxy resin quickly under the high temperature or irradiation with ultraviolet light 9, 10. Consequently, the mono‐component epoxy adhesives, coatings, and castings can be prepared by the use of the latent curing agents 11, 12…”