Thermally conductive epoxy/boron nitride composites with high glass transition temperatures for thermal interface materials

Yue, Cheng’e; Guan, Lizhu; Zhang, Xiaorui; Wang, Yubo; Weng, Ling

doi:10.1016/j.matdes.2021.110190

Cited by 41 publications

(19 citation statements)

References 44 publications

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“…The maximum temperature is 34.7 and 32.3 °C for pure EP and 60 ppi-AF-20 wt% BN/EP as the thermal conductivity material. Figure 6e shows infrared Fe@hBN/EP 30 0.98 2018 [24] Fe@hBN/CNT-NH2/EP 26.43/2 ≈0.78 2018 [24] hBN/CNT-NH2/EP 35/2 1.09 2018 [25] BNNS/CNT/EP 25/1.9 0.84 2019 [26] BN-PVB/EP 40 0.89 2019 [27] Al2O3-CNTS/EP 71 1.73 2019 [28] APTES-BNNS/EP 40 1.62 2020 [29] BN-GFs/EP 15 1.07 2020 [30] SiC-BNNS/EP 20 0.89 2020 [31] BN/EP 30 0.82 2021 [32] KH560-BN/EP 30 0.58 2021 [33] BN-GFC/EP 29.6 0.76 2021 [34] BNNS/EP 30 0.99 2021 [35] MSC@CNTs/EP 0.78 0.51 2022 [36] M(BNs/CNT)15/EP 0.43 0.43 2022 [37] Al2O3/EP 60 0.85 2022 [38] 60 ppi-AF- For high frequency transmission of electronic devices, in order to ensure lossless transmission of signals, the package is required to have a low permittivity and loss tangent. [39][40] Figure 7 shows the permittivity, loss tangent, and electrical conductivity of AF/EP and AF-BN/EP composites.…”

Section: Resultsmentioning

confidence: 99%

Achieving High Thermal Conductivity in Epoxy Resin Composites by Synergistically Utilizing Al₂O₃ Framework and BN Sheet as Fillers

Wang

Zhang

et al. 2022

Macro Materials & Eng

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The application of high thermal conductive Epoxy resin (EP) is an efficient way to improve the heat dissipation in electronic device. In this work, the thermal conductivity of EP is significantly improved by synergistically utilizing Al2O3 framework (AF) and boron nitride sheet (BN) as fillers. The polyurethane foams with different pore sizes are used to prepare AF for the first time. The microstructure characterization demonstrates the successful preparation of AF/EP and AF‐BN/EP with different AF pore size. The thermal conductivity of AF/EP is superior to that of Al2O3/EP composites with randomly distributed Al2O3 nanoparticles. The smaller pore of AF is beneficial to achieving a greater thermal conductivity in AF/EP composites. Especially, by combing BN with AF can further improve the thermal conductivity of AF‐BN/EP composites. The optimal value of 1.18 W m−1 K−1 (5.42 times high than pure EP) is obtained for 60 ppi‐AF‐20 wt% BN/EP composite. Besides, the dielectric property shows that by combining of AF and BN increases the permittivity, as well as low dielectric loss. The high thermal conductivity and excellent dielectric property are simultaneously achieved by synergistically utilizing AF and BN fillers, the resultant EP composites have great potential to be used in electronic devices.

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Section: Resultsmentioning

confidence: 99%

Achieving High Thermal Conductivity in Epoxy Resin Composites by Synergistically Utilizing Al₂O₃ Framework and BN Sheet as Fillers

Wang

Zhang

et al. 2022

Macro Materials & Eng

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“…Over these years, a lot of works has been done to modify epoxy by inorganic fillers. Yue et al 11 found the T g of epoxy increased from 257 to 275 C with a BN content of 30 wt%. 10 Chen et al 12 reported that the T g of epoxy increased from 103.5 to 132.1 C containing 20 wt% micro-AlN particles and 3 wt% nano-AlN particles.…”

Section: Introductionmentioning

confidence: 99%

High heat‐resistant (250°C) epoxy resin composites with excellent dielectric properties

Wang

Feng

Zhang

et al. 2022

J of Applied Polymer Sci

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Insulated gate bipolar transistor (IGBT) is the core of electric energy conversion and circuit control, which is widely used in the field of electric vehicles. Higher service temperature, higher power density, and higher operating voltage are the tendency for IGBT in which packing materials have to possess more stable temperature resistance and better insulating properties. In this work, cyanate ester (CE) and polyhedral oligomeric silsesquioxanes (POSS) are introduced into epoxy with various filling ratio to improve the dielectric and thermal properties. The curing process of every system is determined by non‐isothermal differential scanning calorimetry (DSC). N and Si element distribution mappings indicate that there are good compatibility between POSS, CE, and epoxy. The dielectric test shows that the dielectric constant decreases from 4.34 to 2.84 at 1 MHz and from 4.76 to 2.93 at 1 kHz when the filling ratio is 60 wt%. Meanwhile, the DC breakdown strength increases from 172.7 to 286.4 kV/mm. Furthermore, the glass transition temperature (Tg) increases from 180 to 263°C and the yield of residual carbon increases from 6.2% to 23.7%. A new packing material, which can endure 250°C of operating temperature and has excellent dielectric properties has been synthesized.

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“…The thermal conductivity of BN (30 wt%)/EP composite was 0.58 W/(m K), 142% higher than that of pure EP. 53 Shi et al prepared heterostructured spherical boron nitride (BNN30)@boron nitride nanosheets (BNNS) fillers via electrostatic selfassembly, the electrically insulating laminated composites were prepared by hot pressing. When the mass fraction of hetero-structured filler is 15 wt%, the in-plane and cross-plane thermal conductivities of the laminated composites reach 2.75 and 1.32 W/(m K), respectively.…”

Section: Introductionmentioning

confidence: 99%

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero‐structured GF/BN networks

Liu

et al. 2022

J of Applied Polymer Sci

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Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, highthermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm 2 /s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties.

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Thermally conductive epoxy/boron nitride composites with high glass transition temperatures for thermal interface materials

Cited by 41 publications

References 44 publications

Achieving High Thermal Conductivity in Epoxy Resin Composites by Synergistically Utilizing Al₂O₃ Framework and BN Sheet as Fillers

Achieving High Thermal Conductivity in Epoxy Resin Composites by Synergistically Utilizing Al₂O₃ Framework and BN Sheet as Fillers

High heat‐resistant (250°C) epoxy resin composites with excellent dielectric properties

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero‐structured GF/BN networks

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Thermally conductive epoxy/boron nitride composites with high glass transition temperatures for thermal interface materials

Cited by 41 publications

References 44 publications

Achieving High Thermal Conductivity in Epoxy Resin Composites by Synergistically Utilizing Al2O3 Framework and BN Sheet as Fillers

Achieving High Thermal Conductivity in Epoxy Resin Composites by Synergistically Utilizing Al2O3 Framework and BN Sheet as Fillers

High heat‐resistant (250°C) epoxy resin composites with excellent dielectric properties

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero‐structured GF/BN networks

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About

Achieving High Thermal Conductivity in Epoxy Resin Composites by Synergistically Utilizing Al₂O₃ Framework and BN Sheet as Fillers

Achieving High Thermal Conductivity in Epoxy Resin Composites by Synergistically Utilizing Al₂O₃ Framework and BN Sheet as Fillers