Achieving High Thermal Conductivity in Epoxy Resin Composites by Synergistically Utilizing Al₂O₃ Framework and BN Sheet as Fillers

Abstract

The application of high thermal conductive Epoxy resin (EP) is an efficient way to improve the heat dissipation in electronic device. In this work, the thermal conductivity of EP is significantly improved by synergistically utilizing Al2O3 framework (AF) and boron nitride sheet (BN) as fillers. The polyurethane foams with different pore sizes are used to prepare AF for the first time. The microstructure characterization demonstrates the successful preparation of AF/EP and AF‐BN/EP with different AF pore size. The thermal conductivity of AF/EP is superior to that of Al2O3/EP composites with randomly distributed Al2O3 nanoparticles. The smaller pore of AF is beneficial to achieving a greater thermal conductivity in AF/EP composites. Especially, by combing BN with AF can further improve the thermal conductivity of AF‐BN/EP composites. The optimal value of 1.18 W m−1 K−1 (5.42 times high than pure EP) is obtained for 60 ppi‐AF‐20 wt% BN/EP composite. Besides, the dielectric property shows that by combining of AF and BN increases the permittivity, as well as low dielectric loss. The high thermal conductivity and excellent dielectric property are simultaneously achieved by synergistically utilizing AF and BN fillers, the resultant EP composites have great potential to be used in electronic devices.

Flexible and thermally conductive epoxy‐dispersed liquid crystal composites filled with functionalized boron nitride nanosheets

“…Figure 10A presents the TC of E‐ f ‐BNNS/LCM/Epoxy‐thiol films, f ‐BNNS/LCM/Epoxy‐thiol films and BNNS/Epoxy‐thiol films. Figure 10B,C show the TC enhancement of E‐f‐BNNS/LCM/Epoxy‐thiol films and comparison TC of E‐ f ‐BNNS/LCM/Epoxy‐thiol films and other thermal conductive polymer composites 26,28,37–39 . For E‐ f ‐BNNS/LCM/Epoxy‐thiol films, the TC reaches to 1.65 W/m·K with 30 wt% f ‐BNNS content, which is 511.11% higher than that of epoxy‐thiol polymer (0.27 W/m·K).…”

“…Figure 10B,C show the TC enhancement of E-f-BNNS/LCM/Epoxy-thiol films and comparison TC of E-f-BNNS/LCM/Epoxy-thiol films and other thermal conductive polymer composites. 26,28,[37][38][39] For E-f-BNNS/ LCM/Epoxy-thiol films, the TC reaches to 1.65 W/mÁK with 30 wt% f-BNNS content, which is 511.11% higher than that of epoxy-thiol polymer (0.27 W/mÁK). It is attributed to the LCM's ordered orientation and epoxy-thiol polymer's regular arrangement by high voltage orientation molding.…”

Development and Perspectives of Thermal Conductive Polymer Composites

“…Fillers commonly used in thermal conductive polymer composites include three types: metal fillers (silver, copper, aluminum), carbon-based fillers (carbon nanotubes, carbon fibers, graphene), and ceramic fillers (aluminum oxide, aluminum nitride, boron nitride) [ 2 , 17 , 25 , 26 , 71 , 72 , 73 , 74 , 75 , 76 , 77 ]. The values of thermal conductivity of various fillers at room temperature are shown in Table 2 [ 50 , 78 , 79 , 80 , 81 , 82 , 83 , 84 , 85 , 86 , 87 , 88 , 89 , 90 , 91 , 92 ].…”

Sandwich-Structured Thermal Interface Materials with High Thermal Conductivity

“…7−10 Polymer-based materials are widely used in TIMs due to their excellent mechanical properties and processability. However, their thermal conductivity is low and unstable at high temperatures, which has led to the development of alternative methods to enhance the performance of the high polymer matrix-based TIMs by adding high thermal conductivity materials, such as metal (Al, 11 Ag, 12 and Cu 13 ), ceramic (Al 2 O 3 , 14 BN, 15 and SiC 16,17 ), and carbon-based fillers (diamond, 18 carbon fiber, 19−22 and graphene 23−.25 ). Metal fillers have high thermal conductivity, but their corrosion resistance is weak, and their high density increases the burden of electronic components.…”

“…Therefore, exploring thermal interface materials (TIMs) with high thermal conductivity has become crucial. − Ideal TIM materials require good mechanical properties to match the inherent surface roughness and maintain good contact of heater and heat sink during thermal cycling along with excellent heat transfer performance. − Polymer-based materials are widely used in TIMs due to their excellent mechanical properties and processability. However, their thermal conductivity is low and unstable at high temperatures, which has led to the development of alternative methods to enhance the performance of the high polymer matrix-based TIMs by adding high thermal conductivity materials, such as metal (Al, Ag, and Cu), ceramic (Al 2 O 3 , BN, and SiC , ), and carbon-based fillers (diamond, carbon fiber, − and graphene − ).…”