Abstract:3D packaging technology and TSV (Through Silicon Via) technology have been developed to reduce size and improve performance of semiconductor devices. On the other hand, cooling performance is decreased because thermal sources are accumulated and concentrated by chip stacking. In particular, unsteady thermal loads by hot spot, which is steep temperature elevation within a local area, produce damage in stacked semiconductor chips. In this study, temperature elevation in stacked chips and stresses around TSV stru… Show more
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