Thermal Stress in Bonded Joints

Abstract

This paper considers the stress distributions in bonded materials induced by differential expansion or contraction of these materials. The analytical approach is similar to the lap joint theories attributed to Volkersen and expanded by Goland and Reissner. Several simple and typical analytical models are presented to bring out the relative importance of dlrerent geometrical and material parameters and to give some insight into different modes in which the bonds might fail.

Applicability range of Stoney’s formula and modified formulas for a film/substrate bilayer

“…20,25 Therefore, the deflection and curvature of the bilayer are affected. The interface layer models including the shear-lag model 26 and lap-shear model 27,28 can be used to model the nonideal case by allowing interfacial slip. 20 From Eq.…”

Thermal Management Research for Power Generation. Delivery Order 0002 - Volume 1: Plain Fin Array Cooler for Electronics Cooling

“…Numerous studies were undertaken to investigate interlaminar stresses. An effective approach was based on the beam theory that was originally suggested by Timoshenko [7], then refined by Chen and Nelson [8], Suhir [9], and Jiang et al [10]. This approach was simple and computationally efficient.…”

Effect of Compliant Interface on the Curvature and Stress of Micron-Size Film-Substrate Composite Structure

“…Stress is of a great concern for the reliability of those composite structures [6,7]. As the material properties of film and substrate such as Young's modulus, lattice parameters, coefficients of thermal expansion may be different and also due to the stress build-up during fabrication and processing, the stress inside the film and substrate can be different and result in the deflection of composite structure to relax stress [8]. The following Stoney's 1909 formula [9] serves the cornerstone of relating the stress/force inside film to the curvature of a composite structure 6f cst = 2 hs Es (1) Kst is the curvature and f is the force per unit length inside film (when the film is very thin, f is the surface stress [10]).…”

“…1(a (9) d6ro(x) Go0c d4_o (x) + Fob d2ro(x) dx6 ii dx4 i dx2 (10) GOE(bc -a 2)-co(x) = 0. a and b are defined as follows (1 1 Solving (14) and (15) is a relatively lengthy and complex and here the solution process is omitted. The reader can find the detailed derivation process in reference [2] and [8].…”