Thermal stress analyses of multilayered films on substrates and cantilever beams for micro sensors and actuators

Hsueh, Chun‐Hway; Luttrell, C.R.; Cui, Tianhong

doi:10.1088/0960-1317/16/11/036

Cited by 38 publications

(33 citation statements)

References 22 publications

(34 reference statements)

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“…Before investigation commenced for this study, our software was tested using some multilayer systems like PZT/Ti/SiO2. Satisfactory results in agreement with the results of other investigators 19,20) were obtained. In the present study, 108 FEA models were constructed.…”

Section: Finite Element Formulation and Analysis Of Multilayer Structsupporting

confidence: 92%

Influence of Layer Thickness on Stress Distribution in Ceramic-Cement-Dentin Multilayer Systems

2008

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The effects of dentin and cement thicknesses on stress level and distribution of crack propagation in ceramic-cement-dentin multilayer complex were analyzed. Custom-designed finite element analysis program based on JL Analyzer was used to analyze the stress distribution and present the maximum principal stress locations. In Zirconia, all the maximum stress values were above 100 MPa. In Empress II, they ranged between 50 and 105 MPa, which were approximately one-third of those of Zirconia. In Feldspathic, the maximum stress values were generally lower than 50 MPa. In all groups with 30 μm cement thickness, the highest values were observed at the bottom surface. For cement thicknesses at 50, 70, and 100 μm, maximum stress was found to occur at the top surface. However, changes in dentin thickness did not bring about significant changes in maximum stress values. Results of this study revealed the roles played by the following variables in the failure of a multilayer structure: cement thickness had a minor influence, dentin thickness exerted no influence, but the thickness and type of ceramic system played a significant role.

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Section: Finite Element Formulation and Analysis Of Multilayer Structsupporting

confidence: 92%

Influence of Layer Thickness on Stress Distribution in Ceramic-Cement-Dentin Multilayer Systems

2008

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“…To achieve good thermal isolation from the surrounding substrate, suspended membranes were also introduced into these anemometers. However, these suspended membranes are prone to have a deformation due to the thermal stress induced by temperature changes [4], which could result in an uniformity of the temperature distribution on the chip surface. Besides, in the random vibration or high-g shock conditions, the sensors placed on the suspended membranes are much easier to get fractured than those fabricated on the thick substrate [5].…”

Section: Introductionmentioning

confidence: 99%

A self-packaged self-heated thermal wind sensor with high reliability and low power consumption

Zhu

Chen

Qin

et al. 2015

10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

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A self-packaged self-heated thermal wind sensor was designed, fabricated and measured for the first time in this paper. To achieve a low power and reliable sensor, a newtype silicon-in-glass (SIG) substrate with anisotropic thermal conductivity was introduced. In this substrate, the embedded vertical silicon vias are used to realize the thermal interconnections between the sensor and the wind, while the horizontal thermal conduction between the thermistors is isolated effectively by the glass. The substrate is based on a glass reflow process and the sensor was fabricated on this substrate by using a lift-off process. The whole process only need three masks. At last, we performed a wind tunnel test in constant voltage (CV) mode, and the measurement resultsshow that the thermal wind sensor can measure wind speeds up to 17.5 m/s, and the measured sensitivities of the sensor with different applied voltages of 0.8 V, 0.9 V, and 1 V are respectively 6.3 mV/(m/s), 9.52 mV/(m/s), and 14.17 mV/(m/s) at zero-flow point. The corresponding power consumption of the sensor with different voltages are respectively 12.3 mW, 15.57 mW and 19.23 mW. Measurement results also show that wind direction in a full range of 360 o with an error less than 6 o could be obtained.

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“…This fabrication process can minimize the heat loss effectively. However, the suspended membranes or cantilevers are susceptible to thermal stress caused by temperature changes [6], resulting in a deformation which could affect the uniformity of the temperature distribution on the chip surface. Moreover, in the vibration or shock environments, the sensors based on the suspended membranes or cantilevers are more prone to get fractured compared with those fabricated on the substrate directly [7].…”

Section: Introductionmentioning

confidence: 99%

Development of a robust 2-D thermal wind sensor using glass reflow process for low power applications

Zhu

Chen

Qin

et al. 2015

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

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In this paper, a low-power MEMS two-dimensional (2-D) thermal wind sensor with high reliability is presented. The sensor is based on a glass-in-silicon reflow process. The embedded vertical silicon vias in the glass substrate are used to realize the electrical connections between the sensing elements and the electrode-pads, which are respectively placed on on the front and the back surface of the chip. Then, the sensor and the external circuit are connected using the wire-bonding process through the electrode-pads on the back surface. At last, the bonding wires at the backside is encapsulated by polyester paint, protecting the electrical connections of the sensor from the effect of the external environment. In addition, a passivation layer of nitride is deposited on the surface of the wind sensor to prevent direct exposure of the sensing elements to harsh media. The sensor works in a self-heated mode, which makes its power consumption could be reduced into the sub-milliwatt range, offering high initial sensitivity and wide measurement range, respectively. The sensor was tested in a wind tunnel in constant voltage mode. Measurement results show that the thermal wind sensor can measure wind speeds up to 17.5 m/s with a low power consumption of only 4.81 mW. Measurement results also show that wind direction in a full range of 360°with an error within 6°could be obtained.978-1-4799-8609-5/15/$31.00 ©2015 IEEE

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Thermal stress analyses of multilayered films on substrates and cantilever beams for micro sensors and actuators

Cited by 38 publications

References 22 publications

Influence of Layer Thickness on Stress Distribution in Ceramic-Cement-Dentin Multilayer Systems

Influence of Layer Thickness on Stress Distribution in Ceramic-Cement-Dentin Multilayer Systems

A self-packaged self-heated thermal wind sensor with high reliability and low power consumption

Development of a robust 2-D thermal wind sensor using glass reflow process for low power applications

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