1998
DOI: 10.1016/s0040-6090(97)00512-9
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Thermal stability of nonstoichiometric silicon nitride films made by reactive dc magnetron sputter deposition

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Cited by 21 publications
(5 citation statements)
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“…In the nonstoichiometric AlSiN films, the nitrogen amount it is not sufficient to fill all the positions in the non-metallic sublattice. Thus, Al and Si atoms occupy sites on the non-metallic sublattice, and the presence of Al Al, Al Si and Si Si bonds leads to a lower chemical and thermal stability [35,39]. This non stoichiometry is the main reason for the weaker thermal stability of samples SAON2 and SAON3.…”
Section: Discussionmentioning
confidence: 99%
“…In the nonstoichiometric AlSiN films, the nitrogen amount it is not sufficient to fill all the positions in the non-metallic sublattice. Thus, Al and Si atoms occupy sites on the non-metallic sublattice, and the presence of Al Al, Al Si and Si Si bonds leads to a lower chemical and thermal stability [35,39]. This non stoichiometry is the main reason for the weaker thermal stability of samples SAON2 and SAON3.…”
Section: Discussionmentioning
confidence: 99%
“…On the other hand, sputter-deposition using a ceramic Si 3 N 4 target or a polycrystalline Si target in combination with a nitrogen-rich plasma are also viable alternatives. Typically, a radiofrequency (RF) discharge is applied for synthesis [10][11][12][13][14], but given a sufficient electrical conductivity of the target, direct-current (DC) magnetron sputtering is also a feasible approach [15,16].…”
Section: Introductionmentioning
confidence: 99%
“…[6][7][8][9] Silicon nitride films can be prepared by a variety of methods such as low-pressure chemical vapor deposition (LPCVD), 10,11 plasma-enhanced CVD (PECVD), 12,13 pulsed laser ablation, 14 reactive evaporation, 15 and sputtering. 16,17 Conventionally, high-quality stoichiometric silicon nitride films are obtained by the LPCVD process at temperatures in excess of 700°C. To realize MEMS on the same silicon chip, it is a requirement to integrate the control electronic circuits, usually based on complementary metaloxide-semiconductor (CMOS) technology, with the sensor/actuator/mirror fabrication processing.…”
Section: Introductionmentioning
confidence: 99%
“…Many researchers have reported the deposition of silicon nitride by the RF-sputtering process. [16][17][18][19][20] Silicon nitride deposited by LPCVD and PECVD is widely used as a structural material in the fabrication of different MEMS devices, such as static membranes, tunable inductors, and tunable MEMS Fabry-Pérot optical filters. [6][7][8][9]21,22 However, sputtered silicon nitride has not yet been explored as a structural layer in MEMS.…”
Section: Introductionmentioning
confidence: 99%