Abstract:With the continuing advancement in light-emitting efficiency of high-power light-emitting diodes (LEDs), a nondestructive evaluation on thermal reliability, especially regarding the operating temperature and thermal resistance, which directly affect their lifetime and luminous characteristics, is needed. In this paper, we develop a methodology of using a 3-D numerical simulation for transient thermal-conduction analysis, which is combined with the electrical test method to evaluate the junction temperature of … Show more
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