2020
DOI: 10.1063/5.0018045
|View full text |Cite
|
Sign up to set email alerts
|

Thermal stability for Te-based devices

Abstract: Tellurium (Te) has recently been rediscovered as an attractive semiconducting material for a wide range of electronic and optoelectronic applications. However, thermal instability of Te-based devices has not been investigated and introduces major drawbacks for their practical applications. Toward this goal, this work explores the influence of annealing temperatures on Te transistors and their two failure mechanisms, related to the sublimation of the Te channel and the degradation of the contacts. To overcome t… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
12
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
7

Relationship

1
6

Authors

Journals

citations
Cited by 18 publications
(13 citation statements)
references
References 24 publications
0
12
0
Order By: Relevance
“…[ 15,16 ] Post‐annealing treatments were previously performed on the evaporated Te films in order to further improve crystallinity, decrease the density of grain boundaries, and control crystal orientation, but the relatively high vapor pressure of tellurium leads to re‐evaporating of films during post‐annealing, creating a rough surface and pinholes in films, thus poor electrical properties. [ 17–20 ]…”
Section: Introductionmentioning
confidence: 99%
“…[ 15,16 ] Post‐annealing treatments were previously performed on the evaporated Te films in order to further improve crystallinity, decrease the density of grain boundaries, and control crystal orientation, but the relatively high vapor pressure of tellurium leads to re‐evaporating of films during post‐annealing, creating a rough surface and pinholes in films, thus poor electrical properties. [ 17–20 ]…”
Section: Introductionmentioning
confidence: 99%
“…Meanwhile, it would be technologically important to further develop our ALD technique for realizing Te thin films in an atomically thin limit. In this regard, we note that higher deposition temperature is not a preferred option under the current processing conditions because of the intrinsically high vapor pressure of Te , and resultant thermal desorption (Figure S9). In Stage #2, the surface reaction primarily occurs on the as-deposited Te films, and it is a steady-state film growth mode, reducing the GPC of ∼0.48 Å, perhaps ascribed to having fewer adsorption sites than in Stage #1.…”
Section: Resultsmentioning
confidence: 99%
“…Also, the potentials of Te can allow a wide range of applications in (opto-)­electronics, , spintronics, thermoelectrics, and selector devices with its outstanding p-type transport behavior, robust chirality, enhanced thermoelectric figure of merit, and fast switching performance, respectively. For the practical integration of such superior properties into the nanoscale regime, a tailored growth technique that principally yields its thin-film form must be developed to address the inherent quasi-1D character and high vapor pressure of Te , leading to the flake or locally anisotropic growth at elevated temperatures. , In this sense, a low-temperature process is an essential prerequisite for preventing its thermal diffusion and desorption while highly scalable and reliable production is still desired. Thus far, physical vapor deposition techniques including thermal evaporation, , sputtering, , and pulsed laser deposition have been exclusively employed for Te deposition.…”
mentioning
confidence: 99%
“…This property is very favorable for electronics and optoelectronics. [ 14,90–92 ] Like the aforementioned TMDs, the bandgaps of Te are thickness‐dependent. [ 93 ] For bulk to monolayer Te, the bandgap value varies from 0.31 to 1.04 eV.…”
Section: Categories Of Layered 2d Materials Used For Infrared Photode...mentioning
confidence: 99%