Abstract:Accelerated thermal cycling tests are used to ascertain the reliability of solder interconnects in electronics assemblies. These tests typically last a few months and therefore, are highly resource intensive. Thermal shock tests on the other hand are faster but have been found to be ineffective in accelerating thermal cycling failures for eutectic tin lead solder. In this paper, thermal shock testing is proposed as an alternative to conventional thermal cycling testing for lead-free solder interconnects using … Show more
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