“…A number of interesting observations were made during the research works aiming at investigating the thermal shock resistance. The thermal shock resistance analysis of ceramic media was mainly focused on the measuring and calculating of Young's modulus and retained strength after thermal shock (Dimitrijevic, Posarac, Majstorovic, Volkov-Husovic, & Matovic, 2009;Ding, Zeng, & Jiang, 2006;Kan, Wei, Meng, & Xu, 2009;Orenstein & Green, 1992;Rendtorff, Garrido, & Aglietti, 2011;Vedula, Green, & Hellman, 1998;You et al, 2005), the length of crack growth (Panda, Kannan, Dubois, Olagnon, & Fantozzi, 2002;Yuan, 2008), and thermal stress resistance parameter (R 0 f ) (Vedula, Green, & Hellman, 1999). It is essential to establish theoretical models for the evaluation of thermal shock resistance behavior of these advanced materials.…”