Thermal response of a flat heat pipe sandwich structure to a localized heat flux

Carbajal, Gerardo; Sobhan, C. B.; Peterson, G. P.; Queheillalt, Douglas T.; Wadley, H.N.G.

doi:10.1016/j.ijheatmasstransfer.2006.03.035

Cited by 46 publications

(21 citation statements)

References 31 publications

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“…The effects of heat source strength and separation were studied, and the importance of accounting for axial thermal diffusion was noted. Carbajal et al [110] used a numerical finite volume analysis to obtain the temperature distribution on the back side of a vapor chamber subjected to a non-uniform heating profile. To reduce computational cost, a simplified transient, three-dimensional model intended for implementation into system-level models was developed by Chen et al [111].…”

Section: Numerical Modeling Approachesmentioning

confidence: 99%

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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Owing to their high reliability, simplicity of manufacture, passive operation, and effective heat transport, flat heat pipes and vapor chambers are used extensively in the thermal management of electronic devices. The need for concurrent size, weight, and performance improvements in high-performance electronics systems, without resort to active liquid-cooling strategies, demands passive heat spreading technologies that can dissipate extremely high heat fluxes from small hot spots. In response to these daunting application-driven trends, a number of recent investigations have focused on the design, characterization, and fabrication of ultra-thin vapor chambers for proximate heat spreading away from these hot spots. The predominant transport mechanisms and operational limits have been found to be different under these conditions relative to conventional low-power heat pipes. Noteworthy advances in the fundamental understanding of evaporation and boiling from porous microstructures fed by capillary action, and improvements in vapor chamber characterization, modeling, design, and fabrication techniques are reviewed. Characterization of evaporation and boiling from idealized and realistic wick structures, observation of vapor formation regimes as a function of operating conditions, assessment of fluid dryout limitations, design of novel multi-scale and nanostructured wicks for enhanced transport, and incorporation of these high heat flux transport phenomena into device-level models are discussed. These recent developments have successfully extended the maximum operating heat flux limits of vapor chambers.2

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Section: Numerical Modeling Approachesmentioning

confidence: 99%

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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show abstract

“…Lefèvre and Lallemand [6] developed a twodimensional hydrodynamic model coupled with a three-dimensional heat conduction model to analyze the performances of flat micro heat pipes. Carbajal et al [7] developed a two-dimensional model to investigate the thermal response of a flat heat pipe next to a local heat source.…”

Section: Introductionmentioning

confidence: 99%

“…The CFD techniques have been also used in many of the detailed heat-pipe analyses [1][2][3][4][5]7]. However, some boundary conditions or assumptions are not available in the current commercial software.…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation of a heat sink embedded with a vapor chamber and calculation of effective thermal conductivity of a vapor chamber

Chen

Chien

Hung

et al. 2009

Applied Thermal Engineering

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“…It was concluded that the stacked metal-etched micro wick structure can provide capillary pressure sufficient to exceed the pressure drops. Carbajal et al (2006) analysed the temperature distribution of flat heat pipes with aluminium sandwich wick and compared the performance of the vapor chamber with a copper block. It was found that the temperature at the bottom surface of the vapor chamber is much flatter than that of the solid copper block.…”

Section: Introductionmentioning

confidence: 99%

Thermal Performance of Vapor Chamber With Nanofluids

Shukla¹,

Solomon²,

Pillai³

2013

Frontiers in Heat Pipes

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Thermal response of a flat heat pipe sandwich structure to a localized heat flux

Cited by 46 publications

References 31 publications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Numerical simulation of a heat sink embedded with a vapor chamber and calculation of effective thermal conductivity of a vapor chamber

Thermal Performance of Vapor Chamber With Nanofluids

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