Numerical simulation of a heat sink embedded with a vapor chamber and calculation of effective thermal conductivity of a vapor chamber

Chen, Yen Shu; Chien, Kuo Hsiang; Hung, Tzu-Chen; Wang, Chi-Chuan; Ferng, Yuh-Ming; Pei, Bau-Shei

doi:10.1016/j.applthermaleng.2008.12.009

Cited by 66 publications

(26 citation statements)

References 26 publications

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“…To reduce computational cost, a simplified transient, three-dimensional model intended for implementation into system-level models was developed by Chen et al [111]. The linear model assumed negligible thermal resistance due to vapor convection, and treated the vapor as a common interface between the evaporator and condenser wicks; the utility and accuracy of the model were later demonstrated through analysis of a complete thermal heat sink package with an embedded vapor chamber [112]. Additional detailed, three-dimensional numerical models that solved for flow and heat transport in vapor chambers were presented by Koito et al [113] and Xiao and Faghri [114].…”

Section: Numerical Modeling Approachesmentioning

confidence: 99%

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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Owing to their high reliability, simplicity of manufacture, passive operation, and effective heat transport, flat heat pipes and vapor chambers are used extensively in the thermal management of electronic devices. The need for concurrent size, weight, and performance improvements in high-performance electronics systems, without resort to active liquid-cooling strategies, demands passive heat spreading technologies that can dissipate extremely high heat fluxes from small hot spots. In response to these daunting application-driven trends, a number of recent investigations have focused on the design, characterization, and fabrication of ultra-thin vapor chambers for proximate heat spreading away from these hot spots. The predominant transport mechanisms and operational limits have been found to be different under these conditions relative to conventional low-power heat pipes. Noteworthy advances in the fundamental understanding of evaporation and boiling from porous microstructures fed by capillary action, and improvements in vapor chamber characterization, modeling, design, and fabrication techniques are reviewed. Characterization of evaporation and boiling from idealized and realistic wick structures, observation of vapor formation regimes as a function of operating conditions, assessment of fluid dryout limitations, design of novel multi-scale and nanostructured wicks for enhanced transport, and incorporation of these high heat flux transport phenomena into device-level models are discussed. These recent developments have successfully extended the maximum operating heat flux limits of vapor chambers.2

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Section: Numerical Modeling Approachesmentioning

confidence: 99%

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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“…Chang et al [8] experimentally investigated the effects of the evaporation surfaces, fill ratios of working fluid and input heating powers on the thermal performance of the heat pipe cooling system with the thermal resistance model. Chen et al [9] presented a numerical investigation of a plate-fin heat sink embedded with a vapor chamber, subject to the influence of concentrated heat sources. Zhang et al [10] numerically and experimentally investigated the flat two-phase thermosyphon.…”

Section: Introductionmentioning

confidence: 99%

On the thermal cooling of central processing unit of the PCs with vapor chamber

Naphon

Wiriyasart

2012

International Communications in Heat and Mass Transfer

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“…The vapor is substituted with a domain that has very large thermal conductivity. [2,19,41] Thereby the model will become purely conduction based and will be much simpler to solve.…”

Section: Vapor Chamber Simulationmentioning

confidence: 99%

“…Simplified models have been created to resolve this problem. [1,2] However, most of them divide the vapor chamber into functional sections like the wall, the wick and the vapor space. This creates a model that can represent well the mathematical properties of the vapor chamber, but sometimes these can be hard to integrate into existing software.…”

Section: Introductionmentioning

confidence: 99%

Flexible CFD simulation model of a thin vapor chamber for mobile applications

Niittymaki¹,

Biber

Carbone

2016

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Heat loads produced by electronics inside a mobile device are increasing as more computing power is packed into them. During the design phase of a product, these loads have to be taken into account. Simulations provides a way to try different designs more quickly, and built-in optimization tools help to find the most suitable solution.Vapor chambers are thin heat spreaders that offer very high spreading capabilities without adding too much thickness to a low profile device. They work by evaporating water to steam, which transfers heat away from a heat source to the cooler regions of the chamber. This means that to simulate a vapor chamber correctly it would require simulating phase changes and rapid mass flows in very thin volume. This would consume a lot of computing time, which makes it unusable in detailed simulation in the system level models. Therefore, a simpler model has to be developed. A few of these exist, but they were considered to be too complex for the current application. The goal of this thesis was to develop a behavioral model, which would model the vapor chamber as one domain in the CFD simulation model. Experimental data was taken as the basis of the behavioral model. The measurements were done with a 0.6 mm vapor chamber and a 3 mm copper reference sample. The experimental setup was replicated into a commercial CFD simulation software and the model was tuned to match with the calibration sample. Then, using the tuned model, the thin vapor chamber was simulated by assuming various thermal conductivity values.Data from the simulations were compared to the experiments by using RMSE minimization. It produced a function that described how the vapor chamber's effective conductivity changes with temperature. To use the algorithm built into the CFD software, a linear approximation was applied to the function. The linearization provided parameters that enabled to create a temperature dependent material model that was used in the one cuboid behavioral model of the vapor chamber.ii TIIVISTELMÄ LAURI NIITTYMÄKI: Joustava höyrykammion simulointimalli mobiililaitteiden lämpösimulaatioihin Tampereen teknillinen yliopisto Diplomityö, 47 sivua Lokakuu 2016 Materiaalitekniikan diplomi-insinöörin tutkinto-ohjelma Pääaine: Materiaalitutkimus Tarkastaja: professori Veli-Tapani Kuokkala Avainsanat: höyrykammio, käyttäytymismalli, lämmönhallinta, lämmön levytys, simulointi, CFD, mobiililaite Kasvava laskentateho kannettavissa laitteissa nostaa myös niiden sisällä olevan elektroniikan tuottamaa lämpökuormaa. Laitteen suunnitteluvaiheessa lämmöntuotto pitää ottaa huomioon, jotta laitetta on turvallista käyttää. Simulointi on yksi työkaluista, joita käyte-tään suunnitteluvaiheessa löytämään paras ratkaisu. Se mahdollistaa erilaisten ratkaisujen kokeilun, ja ohjelmiston optimointityökalut auttavat parhaan ratkaisun löytämisessä.

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Numerical simulation of a heat sink embedded with a vapor chamber and calculation of effective thermal conductivity of a vapor chamber

Cited by 66 publications

References 26 publications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

On the thermal cooling of central processing unit of the PCs with vapor chamber

Flexible CFD simulation model of a thin vapor chamber for mobile applications

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