1987
DOI: 10.1002/app.1987.070330615
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Thermal properties of rigid polymers. I. Measurement of thermal conductivity and questions concerning contact resistance

Abstract: SynopsisSeveral studies of the influence of contact resistance on the measurement of thermal conductivity of polystyrene using a steady-state device are presented. In each case it is seen that, although this influence can perhaps be minimized, it cannot be eliminated as an experimental complication. A novel technique is then d d b e d which does eliminate entirely contact resistance as a variable, and this technique is shown to yield an unequivocal value of thermal conductivity.

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Cited by 25 publications
(3 citation statements)
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“…The effect of contact resistance on the temperature readings in similar systems has been shown to be small, chiefly due to the excellent adhesion of the epoxy to the thermocouple wire [22]. The coefficient of thermal expansion of amine-cured epoxy resins is approximately 6.81 Â 10 À5 K À1 [23].…”
Section: Temperature Measurementmentioning
confidence: 99%
“…The effect of contact resistance on the temperature readings in similar systems has been shown to be small, chiefly due to the excellent adhesion of the epoxy to the thermocouple wire [22]. The coefficient of thermal expansion of amine-cured epoxy resins is approximately 6.81 Â 10 À5 K À1 [23].…”
Section: Temperature Measurementmentioning
confidence: 99%
“…We have taken the solution from [3] that includes the effect of contact resistance, and determined that even for worst-case values of contact resistance anticipated (= 0.9 X 10-4 01 2 K/W for silicon chip/aluminum with 0.02-mm epoxy [4]), the effect on the expected values of thermal conductivity for the measurements presented here will be less than 0.08%. The influence of contact resistance in systems similar to that studied here is also shown from experimental results to be small in both [5] and [13], chiefly because of the excellent adhesion of the epoxy material to the heater wire. The coefficient of thermal expansion of amine-cured epoxy resins is approximately 6.81 X 10-5 K-' [14].…”
Section: Contact Resistancementioning
confidence: 71%
“…This is even more the case of a metal, such as In, used as a reference substance for temperature calibration. Furthermore, at the melting temperature of In the contact resistance between In and a solid polymer is negligible [14,23] (namely, contact resistances are defined only for contact between two solids) and, because of the high thermal conductivity of In, only the polymer limits the heat exchange rate. Indeed, the DSC curve International Journal of Polymer Science of In laying on PTFE shows that the fusion of In apparently occurs at temperature higher than its melting temperature (156.6 ∘ C) when an underlain sheet of PTFE is also present.…”
Section: Theorymentioning
confidence: 99%