Measurement of the Temperature and Cure Dependence of the Thermal Conductivity of Epoxy Resin

Chern, Bih Cherng; Moon, Tessie J; Howell, John R.

doi:10.1080/08916159308946451

Cited by 12 publications

(14 citation statements)

References 16 publications

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“…developed software called Rayheat in order to predict the distribution of the radiative intensity in PET preforms. Chern et al 1–4 successfully studied the radiative curing process of hoop‐wound cylinders of graphite/epoxy and glass/epoxy. Previously, we have studied the curing process of a composite, the physical geometry of which corresponds to a carbon/epoxy block, manufactured by the LRI process.…”

Section: Ir Interactionmentioning

confidence: 99%

“…Because of their good adhesive properties, superior mechanical, chemical and thermal properties, and resistance to fatigue and microcracking, they produce high performance composites. Since it is necessary to optimize the manufacturing time and costs and to determine the performance of these composites, some researchers1–4 have studied infrared (IR) heating for the polymerization process. Others5, 6 have used IR energy for the preheating process.…”

mentioning

confidence: 99%

“…Consequently, for the production of high performance composites, it is necessary to know the thermal behavior of the composite during curing. The most detailed models for the curing process of composites using IR heaters have been presented by Chern et al 1–4 They measured the radiative properties of graphite/epoxy and glass/epoxy systems and modeled the radiative heat transfer in the glass/epoxy system as a volumetric radiation transport. Therefore, IR interactions with the graphite/epoxy system were modeled as a surface radiation transport.…”

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confidence: 99%

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Using IR energy is an efficient method of curing composites. In this paper, we study IR interactions with the composite, which is placed in an IR oven. The liquid resin infusion technique is used for the impregnation process of fibers with resin. Numerical simulations of the curing process for a carbon fiber‐reinforced epoxy (RTM6) system are presented. In‐lab software called Rayheat based on ray tracing algorithms and developed in Matlab is used to compute the radiative heat flux that impacts the composite. A three‐dimensional numerical model is developed in the finite element software Comsol Multiphysics, where the heat‐balance equation is coupled with the cure kinetic model of the resin. The computed radiative heat flux is exported to Comsol Multiphysics and imposed as a boundary condition on the top surface of the composite. This numerical model allows calculation of the temperature distribution in the composite during curing, which is a key parameter that affects its mechanical properties. We can predict also the evolution of the degree of cure as function of time.

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Section: Ir Interactionmentioning

confidence: 99%

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confidence: 99%

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confidence: 99%

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“…These results are presented here as a function of process temperature and degree of cure. Differential Scanning Calorimeter (DSC) [8,9] and the line source method [10] were applied in the experiments.…”

Section: Introductionmentioning

confidence: 99%

“…Thermal conductivity of the Hercules 3501-6 epoxy system for 11.5, 51.2 and 100% degrees of cure[10].…”

mentioning

confidence: 99%

New Experimental Data for Enthalpy of Reaction and Temperature- and Degree-of-Cure-Dependent Specific Heat and Thermal Conductivity of the Hercules 3501-6 Epoxy System

Chern

Moon

Howell³

et al. 2002

Journal of Composite Materials

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Measurements of enthalpy of reaction and temperature-and degreeof-cure-dependent specific heat and thermal conductivity are reported for a commercial epoxy resin system (Hercules 3501-6 resin). A Differential Scanning Calorimeter (DSC) was used to determine heat of reaction and specific heat while the line source method was employed for thermal conductivity. The measured heat of reaction of 508 AE 19 J/g is compared with conflicting data previously reported by others. Specific heat is reported in the temperature range of 320-550 K and at degrees of cure 20, 40, 74 and 100%. Both raw data and polynomial curve fits are reported. Thermal conductivity is reported in the temperature range of 298-500 K and at degrees of cure 11.5, 51.2 and 100%. These data are found to be independent of degree of cure within experimental error over this range. The data are represented by e ¼ ð0:202 þ 6:122 Â 10 À3 T À 4:8107 Â 10 À5 T 2 þ 1:248 Â 10 À7 T 3 À 1:043 Â 10 À10 T 4 ÞðW=m KÞ The fractional uncertainty (based on two standard deviations) of the measured enthalpy of reaction, specific heat and thermal conductivity is estimated to be less than AE 3.7, AE 5 and AE 11.8%, respectively.

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Modeling temperature dynamic effects for high‐power light‐emitting diodes

Kyatam

Rodrigues

Alves

et al. 2022

Circuit Theory & Apps

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Temperature is a dynamic variable in most electronic devices. As the device operates, it generates heat, which translates in a temperature increase. Available models commonly disregard these variations due to the fact that they manifest at very large time scales. However, temperature dynamic effects have profound implications on the device model and on our common understanding. This paper discusses implications of considering the temperature variations on the current-voltage characteristic curves of power light-emitting diodes. The main theoretical results establish that the current equation has a memristive nature when temperature is assumed as a dynamical state variable. This hypothesis is then validated experimentally. K E Y W O R D SDC characteristic, hysteresis, memristor, power diode, power LED, thermo-electrical diode model | INTRODUCTIONStandard thermal analysis of power electronic circuits usually assumes static temperature conditions, that is, temperature evolution is considered a very slow process when compared to the operating frequencies. Under this simplifying assumption (and assuming one can neglect the transfer of heat through radiation and convection), the thermal analysis of a given circuit follows straightforward Ohm's law-like relations, where temperature increases linearly with the dissipated power with a slope equal to the thermal resistance of the device. 1 This simple relation is the basis of conventional heat sink (HS) selection procedures, where a series of multiple thermal resistances account for the heat conduction from the device's active region, where it is generated, to the environment, where it is dissipated.Temperature is also a parameter that influences the device's characteristics. Current-voltage relations in diodes and transistors involve temperature in multiple instances: (i) the thermal voltage k B T=q (where k B is the Boltzmann constant and q is the charge of the electron) increases linearly with temperature; (ii) carrier concentrations follow Fermi-Dirac distributions, which are strongly affected by temperature; and (iii) material properties such as thermal conductivity vary with temperature. 2 These temperature-dependent device's current-voltage relations are generally oversimplified and mistreated in the available literature. For instance, it is a common procedure to depict the temperature dependence of the diode current-voltage relation as a collection of curves obtained for different fixed temperature

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Measurement of the Temperature and Cure Dependence of the Thermal Conductivity of Epoxy Resin

Cited by 12 publications

References 16 publications

P139: Effects of a copper medicated intrauterine device on uterine, intrauterine and ovarian arterial blood flow

P139: Effects of a copper medicated intrauterine device on uterine, intrauterine and ovarian arterial blood flow

New Experimental Data for Enthalpy of Reaction and Temperature- and Degree-of-Cure-Dependent Specific Heat and Thermal Conductivity of the Hercules 3501-6 Epoxy System

Modeling temperature dynamic effects for high‐power light‐emitting diodes

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