2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2011
DOI: 10.1109/impact.2011.6117260
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Thermal performance study of next generation fine-pitch chip-on-film (COF) packages — A numerical study

De‐Shin Liu
1
,
Shu-Shen Yeh
2
,
Chieh-Jung Lu
3
et al.
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