Thermal performance of open microchannel heat sink with variable pin fin height

Bhandari, Prabhakar; Prajapati, Yogesh K.

doi:10.1016/j.ijthermalsci.2020.106609

Cited by 137 publications

(33 citation statements)

References 61 publications

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“…Prabhakar Bhandari et al [13] proposed the open rectangular microchannel heat sink with pin fins as the reference channel design, and multi-objective optimization of structural parameters was carried out. Fig.…”

Section: Microchannel Heat Sink Structure and Descriptionmentioning

confidence: 99%

“…where V ⃗ ⃗ is the velocity vector, P is the pressure, T is the temperature, f , f , f , C p,f are fluid density, viscosity, thermal conductivity and the specific heat of the coolant, respectively. The superscript t represents the transpose of a particular matrix and subscript f represents the liquid [13]. For the solid substrate, the continuity equation can be simplify to V ⃗ ⃗ =0, and energy equation becomes Eq.…”

Section: Model Calculation and Processingmentioning

confidence: 99%

“…Throughout the analysis, the coolant was single-phase liquid water. It is worth mentioning that solid zone of the heat sink retain conduction heat transfer whereas convective mode of heat transfer dominates in the fluid zone as well as solid-liquid interface [13]. Hence, SIMPLEC algorithm is used to deal with the direct coupling of velocity and pressure.…”

Section: Model Calculation and Processingmentioning

confidence: 99%

“…Yadav, Vikas et al [12] successively carried out optimization of extended surface microchannel following univariate search method for number of fins, pitch, diameter and height of fins. Prabhakar Bhandari et al [13] studied the heat transfer and fluid flow characteristics of open microchannel heat sink consist of pin fins. It was found that heat transfer rate was affected by increasing the height of the fin.…”

Section: Introductionmentioning

confidence: 99%

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Optimization of open micro-channel heat sink with pin fins by multi-objective genetic algorithm

Jiang

Zhang

2022

Therm sci

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Microchannel heat sink is an effective way to solve the heat dissipation problem of electronic devices because of its compact structure and outstanding heat dissipation ability. In order to obtain the high efficiency and low resistance microchannel heat sink , a new structure of open rectangular microchannel heat sink with pin fins was proposed to enhance heat transfer. The orthogonal test method was used to design the experiment, and the three-dimensional software Solidworks was used to establish 25 groups of open rectangular microchannel heat sink with pin fins structure model which has different structural parameters. The numerical calculation was carried out with ANSYS Fluent simulation software and the experimental values with the structural parameters of the microchannel heat sink as variables were obtained. According to the simulated experimental values, the objective functions of thermal resistance and pumping power were constructed, and the agent model between objective functions and the optimization variables were established. The Pareto optimal solutions of objective functions were calculated by non dominated sorting genetic algorithm NSGA-II, which was analyzed by k-means clustering analysis and five clustering points were obtained, and five clusters points were compared and verified by simulation. it was found that there was effective tradeoff points between the highest and lowest points of the five clustering which can make both the pumping power and thermal resistance within the optimal range, so as to obtain the optimal microchannel heat sink.

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Section: Microchannel Heat Sink Structure and Descriptionmentioning

confidence: 99%

Section: Model Calculation and Processingmentioning

confidence: 99%

Section: Model Calculation and Processingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Optimization of open micro-channel heat sink with pin fins by multi-objective genetic algorithm

Jiang

Zhang

2022

Therm sci

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“…Where the results showed a decrease in thermal performance with increasing the spacing of the fins. Many studies aimed to enhance the efficiency of the heat sink in different ways and techniques summarized by Prabhakar and Prajapati [17]. A study by Bhandari and Prajapati, the effect of fin length has been studied for a small channel containing an open space between the two surfaces, the bottom surface of the heat dissipation basin and the upper surface of the fin.…”

Section: Introductionmentioning

confidence: 99%

Effect of Pitch Ratio and Diagonal Length of Pin Fin of Heat Sink on Convective Heat Transfer for Turbulent Flow Condition

Algburi¹,

Pazarlıoğlu²,

Arslan³

2021

European Journal of Science and Technology

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In this study, the impact of pitch ratio and diagonal length of pin fin on the heat sink has been numerically investigated to determine the thermo-hydraulic performance of heat sink under turbulent flow regime. Usage of pin fin on the heat sink has been preferred due to less pressure drop in comparison with general fin type. While the pitch ratio has been changed 0.75 ≤ P/e ≤ 1.1, the length of edge of fin has been changed 3 ≤ Lef ≤ 6 as geometric parameters. The working range of the study has been considered as turbulent flow regime (2658 ≤ Re ≤ 7138). The computational study has been carried out on ANSYS Fluent 2020R2 using SST k-ω with low-Re correction model to calculate RANS equations. The factors, which define thermo-hydraulic performance of the study, such as average Nusselt number, average Darcy friction factor, and thermal resistance has been elucidated in detail. Also, to detect flow characteristics comprehensively, the contours have been created for vorticity, temperature, and velocity streamline. As a results of overall assessment of this study, it is concluded that the maximum convective heat transfer performance has been obtained using Case 12 by 52% compared with the Case 1 at Re=7138.

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Research progress of the liquid cold plate cooling technology for server electronic chips: A review

Zhou

Dong

Sun

et al. 2022

Intl J of Energy Research

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A significant quantity of research has been dedicated to the application of liquid cold plates to eliminate the high heat flux in server electronic chips. Traditional parallel straight microchannel liquid cold plates suffer from low heat flux density with uneven flow distribution, which poses a serious challenge to high-performance server chip heat dissipation. This paper reviews recent research progress in geometry optimization, interrupted structures, channel patterns, and two-phase flow of liquid cold plates. The optimal geometry parameters of rectangular cross-sectional microchannels including the aspect ratio, length, and hydraulic diameter are summarized. Inquest of higher thermal performance, various interrupted structures (ribs, pin fins, etc.), special channel patterns (wavy-shaped, zigzag-shaped, fractal, serpentine, and doublelayered microchannels, etc.), and two-phase flow on the liquid cold plate are applied to promote fluid-turbulivity and increase heat transfer area, meanwhile they lead to more pressure drop. Furthermore, it is an essential approach to commercialize liquid cold plates by applying the academic and prototype of the liquid cold plate to manufacturing and liquid cooling system solutions. In the end, this review provides a discussion about the limitations of current research on liquid cold plates and an outlook on future research directions.

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Thermal performance of open microchannel heat sink with variable pin fin height

Cited by 137 publications

References 61 publications

Optimization of open micro-channel heat sink with pin fins by multi-objective genetic algorithm

Optimization of open micro-channel heat sink with pin fins by multi-objective genetic algorithm

Effect of Pitch Ratio and Diagonal Length of Pin Fin of Heat Sink on Convective Heat Transfer for Turbulent Flow Condition

Research progress of the liquid cold plate cooling technology for server electronic chips: A review

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