Thermal performance of direct illumination high-power LED backlight units with different assembling structures

Wang, Yiwei; Cen, Jiwen; Cao, Wenbin; Jiang, Fangming

doi:10.1007/s00231-016-1925-z

Cited by 2 publications

(1 citation statement)

References 40 publications

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“…Even with less localized heat distribution in direct-lit BLU, hotspots due to the heat dissipation in LEDs impose thermal challenges, especially for the screen display in the open environment. Many studies investigate ways to minimize the thermal failure in LCD and LED configurations ranging from placement methods including PCB and cooling boss to optimization of reflector patterns [16,17].…”

Section: Direct-lit Backlight Unitmentioning

confidence: 99%

Thermal Modeling of Air Cooled Outdoor Digital Displays

Kim

Joshi

Brown³

et al. 2019

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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for their valuable feedback on my work, along with the remaining crew of MRI for their assistance. Last but not least, I would like to thank my parents and brother who have supported me since the day we moved to the United States. vTABLE OF CONTENTS ACKNOWLEDGEMENTS iv LIST OF TABLES vii LIST OF FIGURES viii LIST OF SYMBOLS AND ABBREVIATIONS x SUMMARY xii CHAPTER 1. Introduction CHAPTER 2. Background and Literature Review 2.1 Backlight Unit Configurations 2.1.1 Edge-lit Backlight Unit 2.1.

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Section: Direct-lit Backlight Unitmentioning

confidence: 99%

Thermal Modeling of Air Cooled Outdoor Digital Displays

Kim

Joshi

Brown³

et al. 2019

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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Improved Radial Plane Fins Heat Sink for Light-Emitting Diode Lamps Cooling

Lopes

Costa

2019

Journal of Thermal Science and Engineering Applications

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A numerical study is conducted concerning the improvement of radial plane fins heat sinks for natural convection cooling of light-emitting diode (LED) lamps. The main objective is to maintain the temperature of the heat sink base below a prescribed threshold for a given released heat flux at the heat sink, minimizing its mass and maintaining at a reasonably simple level the manufacturing processes and operations required for its production. Starting from a previously optimized heat sink for the same purpose, constituted by complete rectangular radial plane fins, the present study aims at further improvements by considering incomplete rectangular radial plane fins. The main objective of this study is to find the best profile for the turning operation to obtain the radial plane fins lighter configuration. It is found that this can be achieved by removing part of the upper internal corners of the rectangular fins, more specifically shaping a curved cut, leading to heat sink mass reduction up to 32.4%. The geometry of the improved heat sink is of cylindrical nature, obtained from cutting an aluminum extruded bar comprising a cylindrical central core and a number of uniformly distributed rectangular radial plane fins, followed by a simple turning operation to remove their upper internal corners. Even if results concern a particular LED lamp, the main ideas and approach prevail to improve other types of heat sinks for general light and/or electronic components cooling.

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Thermal performance of direct illumination high-power LED backlight units with different assembling structures

Cited by 2 publications

References 40 publications

Thermal Modeling of Air Cooled Outdoor Digital Displays

Thermal Modeling of Air Cooled Outdoor Digital Displays

Improved Radial Plane Fins Heat Sink for Light-Emitting Diode Lamps Cooling

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