2022
DOI: 10.1007/s10973-021-11162-x
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Thermal performance of a radial heat sink with longitudinal wavy fins for electronic cooling applications under natural convection

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Cited by 11 publications
(4 citation statements)
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“…The usage of fins is an effective technique in natural convection heat dissipation engineering applications. Rath et al [40] conducted numerical simulations to explore the implications and performance of wavy longitudinal fins over straight longitudinal fins for heat dissipation augmentation in natural convection; the structure is shown in Figure 7d. It was noted that wavy fins intensified the thermo-buoyant flow and augmented the heat dissipation from the fin surface at certain ranges of the pertinent parameters.…”
Section: Microchannelsmentioning
confidence: 99%
“…The usage of fins is an effective technique in natural convection heat dissipation engineering applications. Rath et al [40] conducted numerical simulations to explore the implications and performance of wavy longitudinal fins over straight longitudinal fins for heat dissipation augmentation in natural convection; the structure is shown in Figure 7d. It was noted that wavy fins intensified the thermo-buoyant flow and augmented the heat dissipation from the fin surface at certain ranges of the pertinent parameters.…”
Section: Microchannelsmentioning
confidence: 99%
“…He concluded that heat flux strongly influences the heat transfer rate and, more so, HS with perforated fins performed better than others. Rath et al [7] numerically examined the thermal characteristics of radial HS consisting of longitudinal corrugated fin with three different number of cycles (one cycle, two cycles, and three cycles). They revealed that the highest value of fin effectiveness and Nusselt number was obtained in corrugated fins with three cycles, followed by two cycles and one cycle.…”
Section: Theoretical Referencementioning
confidence: 99%
“…Heat dissipation has become a critical issue in the development of electronic devices and equipment and has a significant impact on their performance, service lifetime, and reliability. [1][2][3][4] To resolve this issue, thermal interface materials (TIMs) are employed to prepare electronic packaging for heat conduction improvement. [5][6][7][8] Polymers have been widely used as a matrix to fabricate TIMs owing to their low cost, electrical insulation, and easy processability.…”
Section: Introductionmentioning
confidence: 99%