Thermal performance analysis of a thermal enhanced form-stable composite phase change material with aluminum nitride

Xu, Qiao; Kong, Xiangming; Wang, Lu

doi:10.1016/j.applthermaleng.2021.116581

Cited by 31 publications

(5 citation statements)

References 57 publications

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“…Figure 3 a illustrates the arrangement of different fillers within the epoxy matrix, Figure 3 b shows the reaction between the functionalized fillers and EP, and Figure 3 c displays the FTIR spectra of EP and different composites prepared at the highest feasible filler loading achieved in this study. The wide absorption band observed at approximately 551 cm −1 on AlN/EP was ascribed to the Al–N stretching vibration [ 52 , 53 , 54 ], and the broad peak at approximately 533 cm −1 for the AlN–BN/EP composite. Furthermore, in the curves of BN/EP and AlN–BN/EP, two prominent absorption peaks at approximately 751 and 1366 cm −1 were assigned to the out-of-plane bending vibration of B–N–B and in-plane stretching vibration of B–N, respectively [ 55 , 56 , 57 , 58 ].…”

Section: Resultsmentioning

confidence: 99%

Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

Sanchez

Chiu

et al. 2022

Polymers

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In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN–BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN–BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.

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Section: Resultsmentioning

confidence: 99%

Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

Sanchez

Chiu

et al. 2022

Polymers

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“…Additionally, thermal conductivity of PEG/PTF is 43% higher compared to that of PEG. Qiao et al 55 synthesized aluminum nitride/paraffin wax, in which aluminum nitride particles are the support materials and thermal conductivity enhancer, and paraffin wax is the PCM. It is observed that the thermal conductivity of aluminum nitride/ paraffin is 3.154 W/(mÁK), which is 2903% higher compared to that of paraffin.…”

Section: Othersmentioning

confidence: 99%

Thermal properties and applications of form‐stable phase change materials for thermal energy storage and thermal management: A review

Fu,

Wang,

Fang

2023

Energy Storage

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Phase change materials possess the merits of high latent heat and a small range of phase change temperature variation. Therefore, there are great prospects for applying in heat energy storage and thermal management. However, the commonly used solid‐liquid phase change materials are prone to leakage as the phase change process occurs. To address this drawback of solid‐liquid phase change materials, researchers have developed form‐stable phase change materials. There are three main strategies for preparation of form‐stable phase change materials. The objectives of this article are: (1) The form‐stable phase change materials are classified according to the preparation strategy, and the properties of each class of form‐stable phase change materials are presented. (2) The advantages and disadvantages of form‐stable phase change materials are also discussed. (3) It is also summarized that the methods to improve the drawbacks and enhance the characteristics of form‐stable phase change materials. (4) Moreover, the multifunctional form‐stable phase change materials are also described. (5) Finally, applications of form‐stable phase change materials are analyzed and discussed.

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“…1–3 However, the development of fatty acid organic phase change materials (PCMs) is limited by factors such as low thermal conductivity and easy liquid leakage during solid–liquid phase transformation. The selection of nanofillers can effectively improve the thermal conductivity, such as, silicon dioxide, 4,5 BN, 6 aluminum oxide, 7 aluminum nitride, 8 carbon nanotube, 9 and titanium dioxide. 10…”

Section: Introductionmentioning

confidence: 99%

Highly thermal conductive shape-stabilized composite phase change materials based on boron nitride and expanded graphite for solar thermal applications

Huang

et al. 2023

RSC Adv.

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Thermal performance analysis of a thermal enhanced form-stable composite phase change material with aluminum nitride

Cited by 31 publications

References 57 publications

Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

Thermal properties and applications of form‐stable phase change materials for thermal energy storage and thermal management: A review

Highly thermal conductive shape-stabilized composite phase change materials based on boron nitride and expanded graphite for solar thermal applications

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