2006
DOI: 10.1002/adem.200500188
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Thermal Oxidation Study on Lead‐free Solders of Sn‐Ag‐Cu and Sn‐Ag‐Cu‐Ge

Abstract: Heat treatment experiments were carried out in SX-12-10 electric furnace. The experimental conditions are as follows: a. 450°C × 15 min (holding time) with cooling in the furnace (FC); b. 500°C × 15 min (holding time) with cooling in air (AC); c. 550°C × 15 min (holding time) with cooling in water (WC). The measurements of the linear recovery behavior of the Ti-Ni alloy springs involved the below steps. Firstly, Ti-Ni alloy springs were pre-drawn and unloaded at ambient temperature. Secondly, the springs were … Show more

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Cited by 26 publications
(4 citation statements)
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“…Lead-free solders sometimes display a yellow discoloration, particularly during the reflow process, and previous surface studies of this phenomenon on Sn-Ag-Cu solders have been reported [5][6][7]. In an X-ray Photoelectron Spectroscopy (XPS) study of a Sn-3.0Ag-0.5Cu solder alloy [5], a yellow discoloration of the usual metallic sheen was observed after five reflows. The thickness of the yellow oxide was determined to be 20 nm.…”
Section: Introductionmentioning
confidence: 95%
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“…Lead-free solders sometimes display a yellow discoloration, particularly during the reflow process, and previous surface studies of this phenomenon on Sn-Ag-Cu solders have been reported [5][6][7]. In an X-ray Photoelectron Spectroscopy (XPS) study of a Sn-3.0Ag-0.5Cu solder alloy [5], a yellow discoloration of the usual metallic sheen was observed after five reflows. The thickness of the yellow oxide was determined to be 20 nm.…”
Section: Introductionmentioning
confidence: 95%
“…The addition of 500 ppm (0.05 wt.%) Ge allowed the metallic sheen on the sample surface to be retained, with an oxide thickness of 10 nm. Ge was not detectable on the surface by XPS after one reflow, but was observed in LMM Auger peaks after five reflows, indicating that Ge had become concentrated within the oxide layer during successive reflows [5]. The authors proposed that a thin layer of GeO x formed within the oxide film protecting the Sn-Ag-Cu-Ge alloy from further oxidation.…”
Section: Introductionmentioning
confidence: 99%
“…To the best of my knowledge, there are hardly any reports on the linear recovery effect of SMA. [1][2][3][4] The present researches focus on the recovery properties of TiNi SMA spring and improvements of the linear recovery effect through heat treatment and rare-earth thermochemical treatment.Linear recovery behavior of shape memory alloy (SMA): For a one-way shape memory effect, if it is deformed in Martensitic state, it will recover when heated, and the recovery quantity depends on temperature. Besides, the recovery proportion of SMA could be defined as the function of temperature.…”
mentioning
confidence: 99%
“…To the best of my knowledge, there are hardly any reports on the linear recovery effect of SMA. [1][2][3][4] The present researches focus on the recovery properties of TiNi SMA spring and improvements of the linear recovery effect through heat treatment and rare-earth thermochemical treatment.…”
mentioning
confidence: 99%