Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems

Abstract

Interconnect formation is critical for the assembly and integration of nanocomponents to enable nanoelectronics- and nanosystems-related applications. Recent progress on joining and interconnect formation of key nanomaterials, especially nanowires and carbon nanotubes, into functional circuits and/or prototype devices is reviewed. The nanosoldering technique through nanoscale lead-free solders is discussed in more detail in this Review. Various strategies of fabricating lead-free nanosolders and the utilization of the nanosoldering technique to form functional solder joints are reviewed, and related challenges facing the nanosoldering technique are discussed. A perspective is given for using lead-free nanosolders and the nanosoldering technique for the construction of complex and/or hybrid nanoelectronics and nanosystems.

From Microjoining to Nanojoining

“…TEM images of Au nanoparticles (a) before and (b) after femtosecond laser nanowelding [22]. further developed for the purpose of nanojoining [32]. Other examples include ultrasonic welding [14], cold welding [16], Fig.…”

“…Recently nanosoldering has drawn significant attention as a possibly significant joining process in the assembly and integration of nanoelectronics devices [32]. Girit and Zettel [33] used a micromanipulator with a tungsten tip to solder In-Tin alloy to make an ohmic contact on graphene, a single atomic layer of carbon.…”

“…This is illustrated in the following example on reflow soldering of multisegmented metal nanowires [17,32,34,35]. Multisegmented metal (such as Sn/Au/Ni) nanowires were fabricated using an electrodeposition method in nanoporous templates [32,17,34,35].…”

“…This is illustrated in the following example on reflow soldering of multisegmented metal nanowires [17,32,34,35]. Multisegmented metal (such as Sn/Au/Ni) nanowires were fabricated using an electrodeposition method in nanoporous templates [32,17,34,35]. In one example, Tin was grown on the ends of Au nanowires with Ni/Au as under-layers (Ni as a diffusion barrier and Au as wetting layer) and then the Sn/Au/Ni coated Au nanowires were reflow soldered together in a liquid medium [35].…”

Encapsulated nanowires: Boosting electronic transport in carbon nanotubes

“…We demonstrate from first principles that encapsulation of 1D atomic chains within a single-walled CNT can enhance decay of "hot" phonons by providing additional channels for thermalisation. Pacification of the phonon population growth reduces electrical resistivity of metallic CNTs by 51% for an example system with encapsulated beryllium.Carbon Nanotubes (CNTs) are the most promising candidates for nanoelectronics applications due to their excellent electrical conductivity [1][2][3]. With these properties applied in integrated circuits and in the field effect transistors' gate electrodes metallic CNTs lead the minituarisation race at the nanoscale [4].…”