Thermal nanoimprint resist for the fabrication of high-aspect-ratio patterns

Messerschmidt, Martin; Schleunitz, Arne; Spreu, Christian; Werner, Thomas R.; Vogler, Marko; Reuther, F.; Bertz, A.; Schift, Helmut; Grützner, Gabi

doi:10.1016/j.mee.2012.07.098

Cited by 4 publications

(4 citation statements)

References 7 publications

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“…Karlsson et al fabricated HAR nanostructures in polycrystalline diamond using NIL with a feature size of 300 nm and a depth of 2 μm [ 6 ]. HAR patterns were fabricated employing a newly developed Si-containing thermal NIL resist by Messerschmidt et al [ 7 ]. Lee et al used thermal NIL to fabricate a GaN light-emitting diode (LED) with three highly refractive patterned structures: submicron holes, microconvex arrays, and HAR pillars [ 8 ].…”

Section: Introductionmentioning

confidence: 99%

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

2017

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High aspect ratio three-dimensional micro- and nanopatterns have important applications in diverse fields. However, fabricating these structures by a nanoimprinting method invites problems like collapse, dislocation, and defects. Finite-element analysis (FEA) is a good approach to help understand the filling process and stress distribution. The FEA method was employed to simulate the nanoimprinting process using positive and negative molds with aspect ratios of 1:1, 3:1, 5:1, and 7:1. During the filling process, the resist adjacent to boundaries has the maximum displacement. The corners of contact areas between the protruding part of the mold and the resist has the maximum Von Mises stress. For both positive and negative molds, the maximum stress in the mold increases with aspect ratio. However, filling up negative molds is more difficult than positive ones. With the same aspect ratio, the maximum stress in a negative mold is approximately twice as large as that in a positive one.

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Section: Introductionmentioning

confidence: 99%

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

2017

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“…Initially SiPol was developed to be used in bilayer system with an organic transfer layer UL1 ( Fig. 1 a-b) [20]. In a standard process, the patterned SiPol layer is thinned down by fluorine based etching chemistry, thus etching both the organic and inorganic content of SiPol, which results in removal of the residual layer.…”

Section: Methodsmentioning

confidence: 99%

“…In this work we present a method capable of pattern DLC films in a straightforward way by using thermal nanoimprint lithography (T-NIL) [19] with the silicon containing SiPol resist (micro resist technology GmbH) [20]. The SiPol standard process was optimized, further simplifying the nanoimprint steps for a pattern transfer in DLC using it as a hard mask.…”

Section: Introductionmentioning

confidence: 99%

Patterning of diamond like carbon films for sensor applications using silicon containing thermoplastic resist (SiPol) as a hard mask

Virganavičius

Cadarso

Kirchner

et al. 2016

Applied Surface Science

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Patterning of diamond-like carbon (DLC) and DLC:metal nanocomposites is of interest for an increasing number of applications. We demonstrate a nanoimprint lithography process based on silicon containing thermoplastic resist combined with plasma etching for straightforward patterning of such films. A variety of different structures with few hundred nanometer feature size and moderate aspect ratios were successfully realized. The quality of produced patterns was directly investigated by the means of optical and scanning electron microscopy (SEM). Such structures were further assessed by employing them in the development of gratings for guided mode resonance (GMR) effect. Optical characterization of such leaky waveguide was compared with numerical simulations based on rigorous coupled wave analysis method with good agreement. The use of such structures as refractive index variation sensors is demonstrated with sensitivity up to 319 nm/RIU, achieving an improvement close to 450% in sensitivity compared to previously reported similar sensors. This pronounced GMR signal fully validates the employed DLC material, the technology to pattern it and the possibility to develop DLC based gratings as corrosion and wear resistant refractometry sensors that are able to operate under harsh conditions providing great value and versatility.

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“…All of these processes have in common that the original structure is a means to make a second step possible. During the last year release of structures in membrane-like devices, additive and subtractive techniques such as etching, lift-off and electroplating were demonstrated and used for different applications [5,33,43,44,91,114,135].…”

Section: Pattern Transfer and Post-processingmentioning

confidence: 99%

Nanoimprint lithography: 2D or not 2D? A review

Schift

2015

Appl. Phys. A

104

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Nanoimprint lithography (NIL) is more than a planar high-end technology for the patterning of wafer-like substrates. It is essentially a 3D process, because it replicates various stamp topographies by 3D displacement of material and takes advantage of the bending of stamps while the mold cavities are filled. But at the same time, it keeps all assets of a 2D technique being able to pattern thin masking layers like in photon-and electron-based traditional lithography. This review reports about 20 years of development of replication techniques at Paul Scherrer Institut, with a focus on 3D aspects of molding, which enable NIL to stay 2D, but at the same time enable 3D applications which are ''more than Moore.'' As an example, the manufacturing of a demonstrator for backlighting applications based on thermally activated selective topography equilibration will be presented. This technique allows generating almost arbitrary sloped, convex and concave profiles in the same polymer film with dimensions in micro-and nanometer scale.

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Thermal nanoimprint resist for the fabrication of high-aspect-ratio patterns

Cited by 4 publications

References 7 publications

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

Patterning of diamond like carbon films for sensor applications using silicon containing thermoplastic resist (SiPol) as a hard mask

Nanoimprint lithography: 2D or not 2D? A review

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