High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

Sun, Hong‐Bo; Yin, Minqi; Wang, Haibin

doi:10.3390/mi8080243

Cited by 6 publications

(4 citation statements)

References 22 publications

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“…4e . This deformation mode is similar to that of an imprinted polymer during the thermal nanoimprinting process reported in previous studies 47 – 49 . The straining capability of NISE is further investigated by simulating the imprinted MoS 2 with various imprint depths.…”

Section: Resultssupporting

confidence: 87%

Nanoimprint-induced strain engineering of two-dimensional materials

Sun,

Zhong,

Gan

et al. 2024

Microsyst Nanoeng

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The high stretchability of two-dimensional (2D) materials has facilitated the possibility of using external strain to manipulate their properties. Hence, strain engineering has emerged as a promising technique for tailoring the performance of 2D materials by controlling the applied elastic strain field. Although various types of strain engineering methods have been proposed, deterministic and controllable generation of the strain in 2D materials remains a challenging task. Here, we report a nanoimprint-induced strain engineering (NISE) strategy for introducing controllable periodic strain profiles on 2D materials. A three-dimensional (3D) tunable strain is generated in a molybdenum disulfide (MoS2) sheet by pressing and conforming to the topography of an imprint mold. Different strain profiles generated in MoS2 are demonstrated and verified by Raman and photoluminescence (PL) spectroscopy. The strain modulation capability of NISE is investigated by changing the imprint pressure and the patterns of the imprint molds, which enables precise control of the strain magnitudes and distributions in MoS2. Furthermore, a finite element model is developed to simulate the NISE process and reveal the straining behavior of MoS2. This deterministic and effective strain engineering technique can be easily extended to other materials and is also compatible with common semiconductor fabrication processes; therefore, it provides prospects for advances in broad nanoelectronic and optoelectronic devices.

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Section: Resultssupporting

confidence: 87%

Nanoimprint-induced strain engineering of two-dimensional materials

Sun,

Zhong,

Gan

et al. 2024

Microsyst Nanoeng

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“…The SiO 2 mold (25 × 25 mm 2 ) had a periodic line array patterned with pitch of 200 nm, line width of 100 nm, and depth of 200 nm. Although it is more conducive to improving the mechanical stability of patterned devices with a small period and large aspect ratio, the imprinting and demolding process with a high aspect ratio and small period is a major issue in nanoimprinting technology [25,26,27]. The period of 200 nm and aspect ratio of 2:1 are relatively mature parameters in nanoimprint technology, being more conducive to the successful preparation of patterns.…”

Section: Methodsmentioning

confidence: 99%

Patterned Metal/Polymer Strain Sensor with Good Flexibility, Mechanical Stability and Repeatability for Human Motion Detection

et al. 2019

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Wearable health monitoring smart systems based on flexible metal films are considered to be the next generation of devices for remote medical practice. However, cracks on the metallic surface of the films and difficulty in repeatability are the key issues that restrict the application of such wearable strain sensors. In this work, a flexible wearable strain sensor with high sensitivity and good repeatability was fabricated based on a patterned metal/polymer composite material fabricated through nanoimprint lithography. The mechanical properties were measured through cyclic tension and bending loading. The sensor exhibited a small ΔR/R0 error line for multiple test pieces, indicating the good mechanical stability and repeatability of the fabricated device. Moreover, the sensor possesses high sensitivity with gauge factors of 10 for strain less than 50% and 40 for strain from 50% to 70%. Various activities were successfully detected in real-time, such as swallowing, closing/opening of the mouth, and multi-angle bending of elbow, which illustrates the proposed sensor’s potential as a wearable device for the human body.

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“…Moreover, understanding the dislocation and spring-back effects can present significant challenges solely with experimental analysis [7,8,18]. The finite element method (FEM) has been applied to study the cavity-filling process and induced stresses in the nanoimprint lithography process for a polymer [19]. Yasuda and his team employed FEM to investigate the material deformation during the NIL process for metal [20].…”

Section: Introductionmentioning

confidence: 99%

Deformation Mechanism of Aluminum, Copper, and Gold in Nanoimprint Lithography Using Molecular Dynamics Simulation

Gaikwad,

Olowe,

Desai

2023

Nanomaterials

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Material deformation during nanoimprinting of aluminum (Al), copper (Cu), and gold (Au) was explored through molecular dynamics simulations. A comparative understanding of the deformation behavior of three substrate materials important for design and high-resolution pattern transfer was highlighted. In this study, we analyzed three metrics, including von Mises stresses, lattice deformation, and spring-back for the chosen materials. Of the three materials, the highest average von Mises stress of 7.80 MPa was recorded for copper, while the lowest value of 4.68 MPa was computed for the gold substrate. Relatively higher von Mises stress was observed for all three materials during the mold penetration stages; however, there was a significant reduction during the mold relaxation and retrieval stages. The Polyhedral Template Matching (PTM) method was adopted for studying the lattice dislocation of the materials. Predominantly Body-Centered Cubic (BCC) structures were observed during the deformation process and the materials regained more than 50% of their original Face-Centered Cubic (FCC) structures after mold retrieval. Gold had the lowest vertical spring-back at 6.54%, whereas aluminum had the highest average spring-back at 24.5%. Of the three materials, aluminum had the lowest imprint quality due to its irregular imprint geometry and low indentation depth after the NIL process. The findings of this research lay a foundation for the design and manufacture of Nanoimprint Lithography (NIL) molds for different applications while ensuring that the replicated structures meet the desired specifications and quality standards.

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High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

Cited by 6 publications

References 22 publications

Nanoimprint-induced strain engineering of two-dimensional materials

Nanoimprint-induced strain engineering of two-dimensional materials

Patterned Metal/Polymer Strain Sensor with Good Flexibility, Mechanical Stability and Repeatability for Human Motion Detection

Deformation Mechanism of Aluminum, Copper, and Gold in Nanoimprint Lithography Using Molecular Dynamics Simulation

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