Thermal monitoring and testing of electronic systems

Szckely, V.; Rencz, M.; Pahi, A.; Courtois, B.

doi:10.1109/6144.774737

Cited by 14 publications

(10 citation statements)

References 6 publications

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“…In paper [2], the phenomenon of thermal inertia into integrated circuits has been described. In [10], a solution for online overheating protection of electronic systems has been proposed, using thermal sensor and thermal monitoring master (TMM) circuit. The use of an additional built-in circuitry to proposed technique allows offline static and transient thermal testing.…”

Section: Introductionmentioning

confidence: 99%

Improvement of microsystem throughput using new cooling system

Samake

Kocanda

Kos

2016

ZN PRz Elektrotechnika

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This paper presents a new possibility of clock frequency/voltage control in microsystems i.e. high performance processors, exploiting information about cooling efficiency. In this paper, we propose an approach that better exploits the thermal abilities of a chip fixed to cooling system in order to eliminate its energy accumulation. For the purpose of the proposed method, the calculation of so called time shift (TS) is introduced. TS is defined as the duration where the computational system can perform the task at higher frequency without any thermal violation when the chip temperature is close to critical thermal threshold. The analogy between thermal and electrical parameters allows to model RC thermal compact model of structure (chip fixed to the cooling system). Based on this assumption, the authors compute the TS value versus different parameters using RC thermal compact model in Spice environment. The results indicate that TS could fulfil a significant part of die total working time. As an effect the proposed approach may be a means for increasing average clock frequency or voltage supply, consequently enhancing the system's throughput.

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Section: Introductionmentioning

confidence: 99%

Improvement of microsystem throughput using new cooling system

Samake

Kocanda

Kos

2016

ZN PRz Elektrotechnika

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“…In addition, two different cooling techniques have been compared in order to assess their efficiency. Based on the data obtained from investigation, an increase of forced convection coefficient may considerably improve the cooling efficiency [10].…”

Section: Resultsmentioning

confidence: 99%

Comparison of different cooling systems using compact model

Samake

Kos

2015

ZN PRz Elektrotechnika

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Due to the strong influence of temperature rising on integrated circuits performance and reliability, an adequate thermal analysis of their cooling systems is required during chip packaging in order to prevent the thermal catastrophe. In this paper, we propose an approach based on RC compact model, which enables in one hand an approximation of dynamic thermal behaviour and in other hand the accurate temperature computation at any measurement point of parallel plate fin heat sink with U-shape channels. Farther more, we present the impacts of convection coefficient on heat sink surface temperature using a simplified approach, which enables the temperature computation by using the RC thermal compact model. Due to the convection coefficient change of surrounding environment, the surfaces and mass of parallel plate fin heat sink with U-shape channels were reduced while enhancing heat transfer capability.

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“…Many temperature sensors consisting of CMOS circuits have been reported [1][2][3][4][5] but are unsuitable for use in the intelligence network systems because of their large power consumption of several hundred microwatts. To achieve ultralow-power operation, we propose a temperature sensor IC that uses MOSFET circuits operated in the subthreshold region.…”

Section: Introductionmentioning

confidence: 99%

Ultralow-Power Smart Temperature Sensor with Subthreshold CMOS Circuits

Ueno

Hirose

Asai

et al. 2006

2006 International Symposium on Intelligent Signal Processing and Communications

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Abstract-We proposed a smart temperature sensor LSI consisting of subthreshold CMOS circuits. The sensor was composed of a bias circuit, a PTAT current generator, an A/D converter, and a counter circuit. All of the circuits were designed so that MOSFETs in the circuits would operate in the subthreshold region to achieve ultralow power consumption. The PTAT current generator was the key component of the sensor and was constructed by using the characteristics of a MOSFET in the subthreshold region. Simulation with SPICE demonstrated that the circuit can be used as a smart temperature sensor with ultralow-power consumption of 6 µW or less.

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Thermal monitoring and testing of electronic systems

Cited by 14 publications

References 6 publications

Improvement of microsystem throughput using new cooling system

Improvement of microsystem throughput using new cooling system

Comparison of different cooling systems using compact model

Ultralow-Power Smart Temperature Sensor with Subthreshold CMOS Circuits

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