Thermal modeling of specialty heat-sinks for low-cost COP packaging of high-power LEDs

Kudsieh, Nicolas; Khizar, M.; Raja, M. Yasin Akhtar

doi:10.1109/honet.2012.6421441

Cited by 5 publications

(3 citation statements)

References 12 publications

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“…COP packaging is one of the most recent technique being exploited for the thermal management of photonicdevices, where high thermal conductivity metal plates are used as submounts. Figure 1 shows a typical COP package diagram used for each assembly element; a more detailed analysis of the COP package and performance is described elsewhere [11]. …”

Section: Introductionmentioning

confidence: 99%

High power LED assemblies for solid state lighting – Thermal analysis

Kudsieh

Bhutta

Raja

2015

Optik

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Section: Introductionmentioning

confidence: 99%

High power LED assemblies for solid state lighting – Thermal analysis

Kudsieh

Bhutta

Raja

2015

Optik

Self Cite

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“…The increase of temperature T j causes a drop in the value of the emitted light stream Φ, a change in the dominant wave length, as well as a decrease in the LED light source lifetime. Exceeding the maximum junction temperature T j declared by the producers may irreversibly damage a semi-conductive light source [8][9][10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis of the Factors Influencing Junction Temperature of LED Panel Sources

et al. 2019

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Limiting junction temperature T j and maintaining its low value is crucial for the lifetime and reliability of semi-conductive light sources. Obtaining the lowest possible temperature of T j is especially important in the case of LED panels, where in a short distance there are many light sources installed, between which there occurs mutual thermal coupling. The article presents results of simulation studies connected with the influence of construction and ambient factors that influence the value of junction temperature of exemplary LED panel sources. The influence of radiator's construction, printed circuit boards, as well as the influence of ambient factors, such as ambient temperature T a and air flow velocity v were subjected to the analysis. Numerical calculations were done in the FloEFD software of the Mentor Graphics company, which is based on computational fluid dynamics (CFD). For construction of the LED thermal panel model the optical efficiency η o and real thermal resistance Rth j-c were determined in a laboratory for the applied light sources.

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“…The rest is dissipated in the form of heat, causing the light extraction efficiency, emission intensity, and lifetime to decrease [15]. Poor thermal management may cause LEDs to fail in a few months, resulting in high LED junction temperatures [16]. Since high power LEDs are widely used in lighting fixtures, designing suitable heat sinks for maintaining a low LED junction temperature is particularly necessary.…”

Section: Introductionmentioning

confidence: 99%

Numerical Simulation and Experimental Validation for the Thermal Analysis of a Compact LED Recessed Downlight with Heat Sink Design

Hsu

Huang

2016

Applied Sciences

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Light emitting diode (LED)-recessed downlighting is currently mainly used for indoor lighting of residential and commercial buildings. Maintaining a low junction temperature and increasing the lifetime and reliability of LED lighting is desirable. This study investigated designed heat sinks' heat dissipation and capability of maintaining a low junction temperature, as well as increases in the lifetime and reliability of the lighting. This paper presents a designed traditional trapezoidal aluminum finned heat sink (ALFHS) and annular open cell copper foam heat sink (CUFHS) mounted to a 10 W compact LED-recessed downlight (CLRDL) and individually installed in a simulation 105 mm × 105 mm × 100 mm (L × W × H) test box. The purpose was to evaluate the temperature performance by testing the downlight in a small enclosed space with high ambient temperature while the LED is in operation. The downlight exhibited a long lifetime at normal use temperature and functioned according to Arrhenius' law. Numerical simulation was performed first and followed by experimental validation. The heat sink design was the main factor in the heat management of the CLRDL. The heat sinks height was determined using numerical simulation and experimental validation before and after installation (INST) of the ALFHS and CUFHS. The CUFHS height was initially selected based on a larger heat dissipation capacity, and then by determining the ALFHS height. Both the ALFHS and CUFHS with the same height of 17 mm exhibited a similar capacity of heat dissipation before INST. Subsequent to INST, the temperature of the solder point of the ALFHS was higher than that of the CUFHS with an identical height of 17 mm. To compare the heat dissipation behavior of the two heat sinks, the ALFHS height was increased to 23 mm, which is 6 mm higher than that of the CUFHS. The results of a stationary simulation study for junction temperature coincides with the experimental results tested obtained using J-type thermocouples and a data acquisition system. The temperature of the solder point of the CLRDL with both the ALFHS and CUFHS was 91.7 • C after INST, corresponding to an LED junction temperature of 121.7 • C, which is lower than specified 135 • C LED limit temperature. The temperature distributions of specified points under natural convection were evaluated. The CLRDL installed in a small enclosed space withstood the lifetime requirements according to the results of an accelerated life test prediction. The CLRDL lumen maintenance was tested to be more than 25,000 h. The experimental results demonstrate compliance with the Energy Star ® requirements for indoor LED lighting fixtures.

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Thermal modeling of specialty heat-sinks for low-cost COP packaging of high-power LEDs

Cited by 5 publications

References 12 publications

High power LED assemblies for solid state lighting – Thermal analysis

High power LED assemblies for solid state lighting – Thermal analysis

Thermal Analysis of the Factors Influencing Junction Temperature of LED Panel Sources

Numerical Simulation and Experimental Validation for the Thermal Analysis of a Compact LED Recessed Downlight with Heat Sink Design

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