2014
DOI: 10.1109/ted.2014.2332414
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Thermal Modeling of Multi-Fin Field Effect Transistor Structure Using Proper Orthogonal Decomposition

Abstract: An approach is proposed to project thermal behavior in a semiconductor integrated-circuit structure onto a functional space based on the proper orthogonal decomposition (POD). The approach substantially reduces the numerical degrees of freedom (DOF) needed for thermal simulations and requires no assumptions about physical geometry, dimensions, or heat flow paths. The POD approach is applied to a multi-fin FinFET structure having heat sources driven by power pulse excitations with time shifts, width variations,… Show more

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Cited by 24 publications
(10 citation statements)
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“…This quantum POD-Galerkin model for a given in ( 9) is therefore constructed with the coefficients evaluated from (11) to (13) via its POD modes. After POD-Galerkin simulation using (9) to determine a , post processing is needed to calculate the WF from (6).…”
Section: Demonstrationsmentioning
confidence: 99%
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“…This quantum POD-Galerkin model for a given in ( 9) is therefore constructed with the coefficients evaluated from (11) to (13) via its POD modes. After POD-Galerkin simulation using (9) to determine a , post processing is needed to calculate the WF from (6).…”
Section: Demonstrationsmentioning
confidence: 99%
“…The concept of POD has been applied to many research areas including fluid dynamics, heat conduction, power distributions and some other problems governed by partial differential equations (PDEs) 3 6 , 17 23 . Many of these studies implemented machine learning, such as neural networks 17 , 18 or radial basis functions 19 , 20 , without incorporating the governing equation of the system.…”
Section: Introductionmentioning
confidence: 99%
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