Thermal modeling for 3D-ICs with integrated microchannel cooling

Power-Thermal Modeling and Control of Energy-Efficient Servers and Datacenters

“…As for liquid-cooled 3D MPSoCs, Mizunuma et al use their thermal model to explore floorplanning solutions to homogenize temperature distributions in this architecture [108]. The results in this work, which is further assisted by the observations in other work [96], show that in the case of liquid cooled 3D MPSoC, temperatureaware floorplanning follows the trend of placing more heat dissipating modules at the fluid inlet port, while lower heat dissipating modules at the outlet port.…”

Temperature-Aware Design and Management for 3D Multi-Core Architectures

“…Compact thermal models for MPSoCs have been widely used in designspace thermal explorations [52] and developing thermally-aware optimization schemes [12], as they provide superior speed-ups with acceptable accuracy compared to the finite-element methods. Initial work on faster modeling approach has been conducted by Koo et al [51].…”

“…As for liquid-cooled 3D MPSoCs, Mizunuma et al use their thermal model to explore floorplanning solutions [72] to homogenize temperature distributions in this architecture [52]. In particular, this work explored the impact of the Polish expressions-based, simulated annealing (SA) thermal placer [72] on the allocation of modules in liquid-cooled 3D MPSoCs.…”

Quantifying Architectural Impact of Liquid Cooling for 3D Multi-Core Processors

“…Microchannels are integrated into a substrate or a heat sink and then inserted between layers. Heat is transmitted by the intermediate structure through a coolant [12,22,29].…”