Thermal modeling and design on smartphones with heat pipe cooling technique

Chiou, Hong-Wen; Lee, Yu-Min; Hsiao, Hsuan-Hsuan; Cheng, Liang-Chia

doi:10.1109/iccad.2017.8203816

Cited by 4 publications

(1 citation statement)

References 7 publications

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“…The efficiency and accuracy of the developed thermal simulator are validated by the commercial tool, ANSYS Fluent. [3] The paper presents a compact thermal model for bended heat pipes and an efficient thermal simulator for smartphones. The thermal simulation with bended heat pipe thermal model can achieve at least three orders of magnitude speedup with only 3.58% maximum error for all chips.…”

Section: Introductionmentioning

confidence: 99%

A Comprehensive Review of PV Solar Panel Thermal Management Systems for Enhancing Thermal Performance and Cooling Efficiency

Singh¹

2023

IJRASET

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This paper presents a comprehensive review of thermal management systems for photovoltaic (PV) solar panels, focusing on strategies to enhance their thermal performance and cooling efficiency. The objective of this review is to analyze the key factors affecting the temperature of PV modules and explore various thermal management techniques employed to mitigate excessive heat and improve energy conversion efficiency. The review begins by discussing the impact of temperature on PV module performance and the associated challenges.

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Section: Introductionmentioning

confidence: 99%

A Comprehensive Review of PV Solar Panel Thermal Management Systems for Enhancing Thermal Performance and Cooling Efficiency

Singh¹

2023

IJRASET

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Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design

Kandlikar

Ganguly

2020

3D Microelectronic Packaging

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Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

Cho

Joshi

2019

Journal of Heat Transfer

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We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through successful completion of the following tasks: patterning copper micropillar wick structures on PCB, mechanical design and fabrication of condenser, device sealing, and device vacuuming and charging with working fluid. Two prototype vapor chambers with distinct micropillar array designs are fabricated, and their thermal performance tested under various heat inputs supplied from a 2 mm × 2 mm heat source. Thermal performance of the device improves with heat inputs, with the maximum performance of ∼20% over copper plated PCB with the same thickness. A three-dimensional computational fluid dynamics/heat transfer (CFD/HT) numerical model of the vapor chamber, coupled with the conduction model of the packaging substrate is developed, and the results are compared with test data.

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Thermal modeling and design on smartphones with heat pipe cooling technique

Cited by 4 publications

References 7 publications

A Comprehensive Review of PV Solar Panel Thermal Management Systems for Enhancing Thermal Performance and Cooling Efficiency

A Comprehensive Review of PV Solar Panel Thermal Management Systems for Enhancing Thermal Performance and Cooling Efficiency

Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design

Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

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