Thermal-mechanical Co-design of Cold Plate, Second Level Thermal Interface Material (TIM2) and Heat Spreaders for Optimal Thermal Performance for High-end Processor Cooling

Wei, Xuan; VanDeventer, A. Cory; Canfield, Shawn; Yu, Yanan; Torok, John; Kelly, Peter; Porter, D. W.; Kostenko, William P.; Zitz, Jeffrey A.; Sikka, Kamal

doi:10.1109/itherm.2016.7517672

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2016

DOI: 10.1109/itherm.2016.7517672

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Thermal-mechanical Co-design of Cold Plate, Second Level Thermal Interface Material (TIM2) and Heat Spreaders for Optimal Thermal Performance for High-end Processor Cooling

Xuan Wei¹,

A. Cory VanDeventer²,

Shawn Canfield³

et al.

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Cited by 4 publications

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Cooling potential of vortex tubes for chip hot spot cooling

Drummond

Sikka

2017

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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Thermal-mechanical Co-design of Cold Plate, Second Level Thermal Interface Material (TIM2) and Heat Spreaders for Optimal Thermal Performance for High-end Processor Cooling

Cited by 4 publications

References 7 publications

Cooling potential of vortex tubes for chip hot spot cooling

Cooling potential of vortex tubes for chip hot spot cooling

Analytical, Numerical and Experimental Study of Phase Change Material in TIM2 Application for High-Power Server CPUs

Stacked Silicon Microcoolers

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