Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology

Wits, Wessel W.; Legtenberg, R.; Mannak, J.H.; Zalk, Bas van

doi:10.1109/iemt.2006.4456432

Cited by 10 publications

(9 citation statements)

References 6 publications

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“…In this case, heat-pipe failure occurred around 10 W due to delamination of the printed circuit board (PCB). In 2006, Wits et al [21] also built an FHP using standard PCB materials and processing. It reached 12 W of power transmission; however, this heat-pipe substrate was still rigid.…”

Section: The Development Of Polymer-based Flat Heat Pipes I Introducmentioning

confidence: 98%

The Development of Polymer-Based Flat Heat Pipes

Oshman

Shi

et al. 2011

J. Microelectromech. Syst.

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In this paper, polymer-based flat heat pipes (PFHPs) with a thickness on the order of 1 mm have been successfully developed and tested. Liquid-crystal polymer (LCP) films with copper-filled thermal vias are employed as the case material. A copper micropillar/woven mesh hybrid wicking structure was designed and fabricated to promote evaporation/condensation heat transfer and the liquid supply to the evaporator of the PFHP. Water was selected as the working fluid because of its superior thermophysical properties. An experimental study was conducted to examine the PFHP performance. The test data demonstrated that the PFHP can operate with a heat flux of 11.94 W/cm 2 and results in effective thermal conductivity ranging from 650 to 830 W/m · K, with the value varying with the input heat flux and the tilt angle. With the employment of flexible LCP as casing material, the PFHP could potentially be directly integrated into a printed circuit board or flexible circuits for thermal management of heat-generating components.[ 2010-0280]Index Terms-Cooling, flat heat pipe (FHP), hybrid wick, polymer.

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Section: The Development Of Polymer-based Flat Heat Pipes I Introducmentioning

confidence: 98%

The Development of Polymer-Based Flat Heat Pipes

Oshman

Shi

et al. 2011

J. Microelectromech. Syst.

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“…In 2006, we presented another design that also integrated the heat pipe directly into the PCB 16,17 . This design is shown in Fig.…”

Section: Current State-of-the-art Of Integrated Heat Pipe Technolmentioning

confidence: 99%

“…This model was also used successfully to predict the performances of the heat pipe used in the measurement set-up of Fig. 4 as presented in 2006 16 . For the working fluid to cycle continuously through the heat pipe, the capillary pressure must be larger than or equal to the sum of all pressure losses.…”

Section: Improving the Integrated Heat Pipe Designmentioning

confidence: 99%

“…Current conductive cooling strategies will no longer suffice for the next generation of phased array radar systems. By contrast, the integrated heat pipes promise an equivalent thermal conductivity of at least 11 times 16 the conductivity of solid copper assuming equal dimensions. Moreover, the heat pipes will also weigh less.…”

Section: B Performance and Applicationmentioning

confidence: 99%

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Advances in integrated heat pipe technology for printed circuit boards

Wits

Riele

2010

40th International Conference on Environmental Systems

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Designing thermal control systems for electronic products has become very challenging due to the continuous miniaturization and increasing performance demands. Two-phase cooling solutions, such as heat pipes or vapor chambers, are increasingly used as they offer higher thermal coefficients for heat transfer. Following a multidisciplinary and integrative design approach, new concepts for two-phase cooling solutions for printed circuit boards are explored. This paper shows that by integrating thermal design criteria early in the total design phase, a radical new way of thermal control can be achieved. A new design to integrate heat pipe technology with printed circuit board technology is presented. This concept improves the overall design flexibility of the electronic product significantly and thermal control is realized and manufactured in a more integrated way. Altogether this allows engineers to design a printed circuit board with full integration of thermal control functionality. Nomenclature

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“…By using silver-filled thermal vias through the ceramic, they were able to increase the effective thermal conductivity from 2.63 W (m K) −1 to 250 W (m K) −1 for the casing material. Wits et al [4] utilized rigid PCBs and axially oriented micro-grooves formed with a selective plating process. They too used metal-filled thermal vias to decrease the casing's thermal resistance.…”

Section: Introductionmentioning

confidence: 99%

Thermal performance of a flat polymer heat pipe heat spreader under high acceleration

Oshman

Liew

et al. 2012

J. Micromech. Microeng.

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This paper presents the fabrication and application of a micro-scale hybrid wicking structure in a flat polymer-based heat pipe heat spreader, which improves the heat transfer performance under high adverse acceleration. The hybrid wicking structure which enhances evaporation and condensation heat transfer under adverse acceleration consists of 100 μm high, 200 μm wide square electroplated copper micro-pillars with 31 μm wide grooves for liquid flow and a woven copper mesh with 51 μm diameter wires and 76 μm spacing. The interior vapor chamber of the heat pipe heat spreader was 30 × 30 × 1.0 mm 3 . The casing of the heat spreader is a 100 μm thick liquid crystal polymer which contains a two-dimensional array of copper-filled vias to reduce the overall thermal resistance. The device performance was assessed under 0-10 g acceleration with 20, 30 and 40 W power input on an evaporator area of 8 × 8 mm 2 . The effective thermal conductivity of the device was determined to range from 1653 W (m K) −1 at 0 g to 541 W (m K) −1 at 10 g using finite element analysis in conjunction with a copper reference sample. In all cases, the effective thermal conductivity remained higher than that of the copper reference sample. This work illustrates the possibility of fabricating flexible, polymer-based heat pipe heat spreaders compatible with standardized printed circuit board technologies that are capable of efficiently extracting heat at relatively high dynamic acceleration levels.

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Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology

Cited by 10 publications

References 6 publications

The Development of Polymer-Based Flat Heat Pipes

The Development of Polymer-Based Flat Heat Pipes

Advances in integrated heat pipe technology for printed circuit boards

Thermal performance of a flat polymer heat pipe heat spreader under high acceleration

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