Thermal Management on IGBT Power Electronic Devices and Modules

Qian, Cheng; Gheitaghy, Amir Mirza; Fan, Jiajie; Tang, Haida; Sun, Bo; Ye, Huaiyu; Zhang, Guoqi

doi:10.1109/access.2018.2793300

Cited by 202 publications

(72 citation statements)

References 116 publications

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“…Several technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed. Thermal modeling is useful in analyzing the heat transfer performance of light-emitting diodes (LEDs) [2,3] and insulated-gate bipolar transistors [4] as it reveals junction temperature, thermal conductivity, and thermal resistance [5,6]. However, temperature and thermal resistance are limited in characterizing energy transmission states systematically.…”

Section: Introductionmentioning

confidence: 99%

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Cai

Cui

Qin

et al. 2020

Entropy

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Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the irreversibility entropy generation methodology is favorable for electronic and mechanical components because the second law of thermodynamics plays a unique role in the analysis of various damage assessment problems encountered in the engineering field. In recent years, numerical and theoretical studies involving entropy generation methodologies have been carried out to predict and diagnose the lifetime of electronic and mechanical components. This work aimed to review previous defect analysis studies that used entropy generation methodologies for electronic and mechanical components. The methodologies are classified into two categories, namely, damage analysis for electronic devices and defect diagnosis for mechanical components. Entropy generation formulations are also divided into two detailed derivations and are summarized and discussed by combining their applications. This work is expected to clarify the relationship among entropy generation methodologies, and benefit the research and development of reliable engineering components.

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Section: Introductionmentioning

confidence: 99%

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Cai

Cui

Qin

et al. 2020

Entropy

Self Cite

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“…The slope of T sw indicates that the temperature will increase 5. open-air conditions, the IGBT's optimum safe current rating is between 8 and 15 A and a 41.92 °C to 78.6 °C rise above the ambient temperature is to be expected. However, alternate cooling techniques that could be used to improve the thermal performance are discussed in [21] and should be considered when additional current is needed or ambient temperatures are unpredictable. Figure 7.…”

Section: Heat and Power Lossmentioning

confidence: 99%

Design and Testing of a Low Voltage Solid-State Circuit Breaker for a DC Distribution System

Tracy

Sekhar

2020

Energies

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In this study, a low voltage solid-state circuit breaker (SSCB) was implemented for a DC distribution system using commercially available components. The design process of the high-side static switch was enabled through a voltage bias. Detailed functional testing of the current sensor, high-side switch, thermal ratings, analog to digital conversion (ADC) techniques, and response times of the SSCB was evaluated. The designed SSCB was capable of low-end lighting protection applications and tested at 50 V. A 15 A continuous current rating was obtained, and the minimum response time of the SSCB was nearly 290 times faster than that of conventional AC protection methods. The SSCB was implemented to fill the gap where traditional AC protection schemes have failed. DC distribution systems are capable of extreme faults that can destroy sensitive power electronic equipment. However, continued research and development of the SSCB is helping to revolutionize the power industry and change the current power distribution methods to better utilize clean renewable energy systems.

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“…The heat transfer coefficient changes greatly depending on how the power module is cooled. Typically, the h-coefficient is up to 100-300 W/m 2 K for forced convection of air, 500-2000 W/m 2 K for modules mounted on heatsink, and 10 000 W/m 2 K or more for direct water cooling [15], [23], [36]- [38]. Fig.…”

Section: Thermal Characteristicsmentioning

confidence: 99%

A Fast-Switching Integrated Full-Bridge Power Module Based on GaN eHEMT Devices

Jørgensen

Bęczkowski

Uhrenfeldt

et al. 2019

IEEE Trans. Power Electron.

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New packaging solutions and power module structures are required to fully utilize the benefits of emerging commercially available wide bandgap semiconductor devices. Conventional packaging solutions for power levels of a few kilowatt are bulky, meaning important gate driver and measurement circuitry are not properly integrated. This paper presents a fast-switching integrated power module based on gallium nitride enhancementmode high-electron-mobility transistors, which is easier to manufacture compared with other hybrid structures. The structure of the proposed power module is presented, and the design of its gate driver circuit and board layout structure is discussed. The thermal characteristics of the designed power module are evaluated using COMSOL Multiphysics. An ANSYS Q3D Extractor is used to extract the parasitics of the designed power module, and is included in simulation models of various complexities. The simulation model includes the SPICE model of the gallium nitride devices, and parasitics of components are included by experimentally characterizing them up to 2 GHz. Finally, the designed power module is tested experimentally, and its switching characteristics cohere with the results of the simulation model. The experimental results show a maximum achieved switching transient of 64 V/ns and verify the power loop inductance of 2.65 nH.

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Thermal Management on IGBT Power Electronic Devices and Modules

Cited by 202 publications

References 116 publications

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components—A Review

Design and Testing of a Low Voltage Solid-State Circuit Breaker for a DC Distribution System

A Fast-Switching Integrated Full-Bridge Power Module Based on GaN eHEMT Devices

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