Thermal management of 3D chip with non-uniform hotspots by integrated gradient distribution annular-cavity micro-pin fins

Feng, Shuai; Yan, Yunfei; Li, Haojie; Zhang, Li; Yang, Shilin

doi:10.1016/j.applthermaleng.2020.116132

Cited by 52 publications

(4 citation statements)

References 30 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It then flowed through the hybrid heat sink and finally into the fluid outlet. As shown in Figure 1 [11], each chip layer had a device layer that generated heat and transferred it to the embedded hybrid heat sink. Thus, an individual hybrid heat sink (see Figure 2a [9]) was heated on both sides.…”

Section: Geometrical Modelmentioning

confidence: 99%

See 1 more Smart Citation

Thermal–Hydrodynamic Behavior and Design of a Microchannel Pin-Fin Hybrid Heat Sink

et al. 2022

View full text Add to dashboard Cite

A three-dimensional convective heat transfer model of a microchannel pin-fin hybrid heat sink was established. Considering the non-uniform heat generation of 3D stacked chips, the splitting distance of pin-fins was optimized by minimizing the maximum heat sink temperature under different heat fluxes in the hotspot, the Reynolds numbers at the entrance of the microchannel, and the proportions of the pin-fin volume. The average pressure drop and the performance evaluation criteria were considered to be the performance indexes to analyze the influence of each parameter on the flow performance and comprehensive performance, respectively. The results showed that the maximum temperature of the hybrid heat sink attained a minimum value with an increase in the splitting distance. The average pressure drop in the center passage of the microchannel first increased and then decreased. Furthermore, the optimal value could not be simultaneously obtained with the maximum temperature. Therefore, it should be comprehensively considered in the optimization design. The heat flux in the hotspot was positively correlated with the maximum heat sink temperature. However, it had no effect on the flow pressure drop. When the Reynolds number and the pin-fin diameter increased, the maximum heat sink temperature decreased and the average pressure drop of the microchannel increased. The comprehensive performance of the hybrid heat sink was not good at small Reynolds numbers, but it significantly improved as the Reynolds number gradually increased. Choosing a bigger pin-fin diameter and the corresponding optimal value of the splitting distance in a given Reynolds number would further improve the comprehensive performance of a hybrid heat sink.

show abstract

Section: Geometrical Modelmentioning

confidence: 99%

“…Scholars worldwide have carried out a substantial amount of research on microchiplevel cooling technology [5][6][7][8][9][10][11][12][13]. Ansari et al [14] proposed a hybrid micro-heat sink for cooling microprocessors with non-uniform heat generation.…”

Section: Introductionmentioning

confidence: 99%

Thermal–Hydrodynamic Behavior and Design of a Microchannel Pin-Fin Hybrid Heat Sink

et al. 2022

View full text Add to dashboard Cite

show abstract

“…There are relatively many research studies on the use of pin fins to enhance heat transfer, but there are still relatively little research on the use of pin fins and counterflow double channel to improve wall temperature in the micro-combustor. Feng et al 46,47 explored the influence of the porosity of the pin fins on heat transfer and pressure loss through theoretical analysis, and they found that the benefit of the heat transfer effect is greater than the loss caused by the pressure drop when the porosity of the pin fins is greater than 0.65.…”

Section: Introductionmentioning

confidence: 99%

Enhancement of combustion and radiation performances in a counterflow double‐channel combustor with pin fins for micro‐thermophotovoltaic system

Gao

Yan

Zhang

et al. 2021

Intl J of Energy Research

Self Cite

View full text Add to dashboard Cite

Summary As one vital role component of micro‐thermophotovoltaic (MTPV) system, the combustion characteristics of the micro‐combustor directly affect the wall temperature distribution and the MTPV system efficiency. Combined with the advantages of counterflow and pin rib arrangement, a counterflow double‐channel micro‐combustor with pin fins (combustor C) was built to enhance the heat transfer and improve the wall temperature. The combustion performances and radiation performances of single‐channel micro‐combustor (combustor A), counterflow double‐channel micro‐combustor (combustor B), and combustor C were investigated and compared under different mass flow rates (4~12 × 10−5 kg/s) and equivalence ratios (0.6~1.4). Results show that the pin fin is of positive significance for the fixation of flame root to improve the combustion stability, combustion efficiency, and radiation energy when the total mass flow rate is high, especially. When the mass flow rate is low, the combustion efficiency of combustor C is the lowest due to the limitation of combustion space. However, with the increase of the mass flow rate, the combustion characteristics of combustor C are the best due to the flame front area is larger among the three combustors and the flame root position is closer to the inlet area. The radiation energy, radiation efficiency, and mean temperature of the upper wall of the combustor C are significantly higher than other combustors under the same conditions. When the total mass flow rate is 12 × 10−5 kg/s, the radiation energy of combustor C is 0.51 times and 0.36 times that of combustor A and B, respectively. When the equivalence ratio is 1.0, the mean upper wall temperature of combustor C is 175.87 and 128.904 K higher than of combustor A and B, respectively. The counterflow double‐channels combustors have better wall temperature uniformity than single‐channel combustor under a wide range of working conditions.

show abstract

“…7 Research shows that over half of the damage problems in electronic devices are caused by insufficient thermal management of the hotspots. 8 All these facts make it an urgent job to remove and alleviate the hotspots in time for the routine operating of the chips.…”

Section: Introductionmentioning

confidence: 99%

Automatically adaptive cooling of hotspots by a fractal microchannel heat sink embedded with thermo‐responsive hydrogels

Yan

et al. 2021

Intl J of Energy Research

Self Cite

View full text Add to dashboard Cite

A smart fractal microchannel heat sink (SFMHS) integrated with thermoresponsive hydrogels is developed for the randomly distributed hotspots sensing and adaptive cooling of microelectronic devices. The equally distributed thermo-responsive hydrogels can firstly sense the temperature rise caused by random hotspots and then work as microfluidic valves to reallocate the coolant by its adaptive thermo-shrinkage. The CFD numerical results show that the proposed SFMHS presents lower and more uniform temperature distribution than FMHS under hotspots conditions. The maximum temperature rise, heat source temperature difference, and heat source temperature SD of SFMHS are 4.47, 4.28, and 0.97 K lower than FMHS at the HSB heat flux of 400 W/cm 2 , respectively. The adaptive cooling superiority of SFMHS gets enhanced with the increase of the hotspots area and heat flux density because more hydrogels shrink, and more flow gets reallocated for hotspot-targeted cooling. However, too low (HSA,400 W/cm 2 ) or too high (HSC, 300 W/cm 2 ) hotspots conditions would result in the worse hotspot cooling of SFMHS with no adaptive flow reallocation because all hydrogels are at the same initial or shrunken sates. Meanwhile, SFMHS is more effective to sense and cooling the hotspots that are closer to hydrogels.

show abstract

Thermal management of 3D chip with non-uniform hotspots by integrated gradient distribution annular-cavity micro-pin fins

Cited by 52 publications

References 30 publications

Thermal–Hydrodynamic Behavior and Design of a Microchannel Pin-Fin Hybrid Heat Sink

Thermal–Hydrodynamic Behavior and Design of a Microchannel Pin-Fin Hybrid Heat Sink

Enhancement of combustion and radiation performances in a counterflow double‐channel combustor with pin fins for micro‐thermophotovoltaic system

Automatically adaptive cooling of hotspots by a fractal microchannel heat sink embedded with thermo‐responsive hydrogels

Contact Info

Product

Resources

About