2005
DOI: 10.1109/jqe.2004.839706
|View full text |Cite
|
Sign up to set email alerts
|

Thermal management in vertical-external-cavity surface-emitting lasers: finite-element analysis of a heatspreader approach

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

1
58
0

Year Published

2009
2009
2021
2021

Publication Types

Select...
5
2

Relationship

1
6

Authors

Journals

citations
Cited by 119 publications
(59 citation statements)
references
References 21 publications
1
58
0
Order By: Relevance
“…[3][4][5][6][7][8][9]. Different thermal management techniques including thin device or heat spreader approaches have been a subject of thermal modelling [3][4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…[3][4][5][6][7][8][9]. Different thermal management techniques including thin device or heat spreader approaches have been a subject of thermal modelling [3][4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%
“…Different thermal management techniques including thin device or heat spreader approaches have been a subject of thermal modelling [3][4][5][6][7]. Moreover, various factors which influence the temperature increase within laser vol− ume such as: pumping−beam properties (e. g., power [5,7], diameter [3,5,8], wavelength [5,6,8], spatial profile [5]), as well as thermal conductivity or thickness of heat spreader [3][4][5][6][7]9], window [5] and DBR mirror layers [7] have been investigated. In this paper the complex comparative analysis of different VECSEL configurations (e.g., as−grown, thin device, heat spreader approaches) has been presented in form of so−called 'thermal maps' which enable determining the maximum temperature at specified pumping conditions in a quick and simple way, so they can be very useful, espe− cially at VECSEL designing.…”
Section: Introductionmentioning
confidence: 99%
“…As such, it is chosen to be pump (and signal) transparent and to provide a sufficient electronic barrier for the carriers. The selection of a highly-thermally-conductive material is favoured to help with heat dissipation [40]. Thickness adjustments of this layer are also often used to suitably tailor the sub-cavity resonance(s) resulting from the FabryPerot interference between the semiconductor chip surface and the DBR.…”
Section: Semiconductor Chip Designmentioning
confidence: 99%
“…To be effective, the heatspreader must offer a much greater thermal conductivity than the semiconductor substrate and be sufficiently thick (typically > 100 μm for diamond) to allow unconstrained heat dissipation to the contact ring (see Fig. 6) [40]. As an intra-cavity element, it also needs to be transparent with low scattering loss at the emission and pump wavelengths [53] and preferably of controlled birefringence to avoid unwanted polarisation loss [42,44].…”
Section: Thermal Managementmentioning
confidence: 99%
See 1 more Smart Citation