Thermal Management in Long-Wavelength Flip-Chip Semiconductor Disk Lasers

Optically pumped VECSELs: review of technology and progress

“…As for their performance, wafer-bonded VECSELs with intermediate layers are considerably less studied than wafer-fused VECSELs. However, the reported output powers of 3-4 W at 1.32 µm [131,171] correspond to the performance of similar wafer-fused structures [47]. Moreover, while being far from a definite comparison, this observation of similar performance is strengthened by the thermal simulations of wafer-bonded VECSELs [56].…”

“…To date, semiconductor-dielectric-metal VECSEL mirrors have been realized with GaAs/AlAs-Al 2 O 3 -Al structures [21,131,132]. The benefits of these materials include high adhesion, high mechanical stability and limited diffusion between the layers [133].…”

“…The simulated reflectivity data is obtained using the 1.32 µm flip-chip VECSEL structure described in [131]. Figure 6 also shows the reflectivity data for a similar VECSEL structure that is assumed to operate at a longer wavelength of 1.6 µm.…”

Novel semiconductor membrane external-cavity surface-emitting laser

“…To overcome the heat flow problems and to improve the performance of VECSELs, numerous thermal management strategies have been previously proposed. Such approaches include changes to the heat spreader arrangement, 8 removing the substrate, 1 flip-chip processes, 9 or the insertion of compound mirrors. 10 According to the natural progression of these developments, all semiconductor components of a VECSEL that are not essential for building a whole laser could eventually be abandoned.…”