Thermal fatigue reliability design of solder bumps in TSV interposer package based on finite element analysis

Xia, Guofeng; Qin, Fei; Chen, Si; An, Tong

doi:10.1109/icept.2013.6756524

Cited by 3 publications

(2 citation statements)

References 4 publications

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“…The thermal fatigue life of the bumps is closely related to the material properties of the underfill. A higher modulus and lower CTE of the underfill can significantly enhance the thermal fatigue life of the bumps [15]. The shape of the bumps also affects the fatigue life.…”

Section: Thermal Reliabilitymentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.

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Section: Thermal Reliabilitymentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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“…Chukwudi Okoro [1] studied the reliability of TSV daisy chains under thermal cycling conditions and evaluated the electrical resistance of the TSV chain by electrical modeling. Xia Guofeng [2] studied the thermal fatigue reliability of solder bumps in TSV interposer packages analyzed by finite element method and optimized factor combination design for promoting thermal fatigue reliability and validated by finite element analysis. Cheryl S [3] established a TSV filled with copper interconnect structure axisymmetric finite element model, analyzed and forecasted the failure of thermal stress of TSV copper interconnect.…”

Section: Introductionmentioning

confidence: 99%

Study on different material parameters on TSV interconnect structures stress and strain under random vibration load

Guoji¹,

Huang²,

Li³

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of the stress and strain of TSV interconnect structure between the micro-bump materials are copper and SAC387. And also comparative analysis the stress and strain by four different solder materials. Keywords-3D-TSV interconnect structure; finite element analysis; random vibration analysis; stress and strain . INTRODUCTION The electronic equipment is more and more widely used in board, automotive and mobile devices. The continuous working ability of the IC devices which use TSV interconnect technology get wide attention when the devices work in high temperature, high humidity, vibration and other harsh environments or specific conditions. The whole performance of the package devices will direct or indirect affected by the reliability of TSV interconnect structure. The reliability issues of TSV interconnect structures get more and more widespread. In recent years, domestic and foreign scholars has expansions a sequence studies on the reliability of TSV interconnect structure. Chukwudi Okoro [1] studied the reliability of TSV daisy chains under thermal cycling conditions and evaluated the electrical resistance of the TSV chain by electrical modeling. Xia Guofeng [2] studied the thermal fatigue reliability of solder bumps in TSV interposer packages analyzed by finite element method and optimized factor combination design for promoting thermal fatigue reliability and validated by finite element analysis. Cheryl S [3] established a TSV filled with copper interconnect structure axisymmetric finite element model, analyzed and forecasted the failure of thermal stress of TSV copper interconnect. The researches of TSV reliability conducted by these scholars are mainly concentration in the thermo -mechanical reliability. But the research of TSV reliability under random vibration environment is rarely reported. In fact, the service environment of electronic equipment become deteriorating in recent years.Electronic products is not only affected by high temperature and high humidity and also affected by shock and vibration [4] . Therefore, the paper chose TSV interconnect structure as research object, The stress and strain distribution of TSV interconnect structure was analyzed by finite element method under random vibration. The reliability of TSV was studied which caused by different fill layer material and micro-bump material under random vibration loads. These studies provide theoretical guidance for improving the 1522

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Study on different material parameters on TSV interconnect structures stress and strain under random vibration load

Guoji

Huang

et al. 2014

2014 15th International Conference on Electronic Packaging Technology

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Thermal fatigue reliability design of solder bumps in TSV interposer package based on finite element analysis

Cited by 3 publications

References 4 publications

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Study on different material parameters on TSV interconnect structures stress and strain under random vibration load

Study on different material parameters on TSV interconnect structures stress and strain under random vibration load

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