1975
DOI: 10.1063/1.321373
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Thermal expansion of some diamondlike crystals

Abstract: The thermal expansion of AlN, cubic BN, and BP has been measured from 77 to 1300 K by x−ray techniques. The derived thermal expansion coefficients are compared with those of diamond, Si, Ge, SiC, GaP, and BeO using the Debye temperature as a scaling parameter. It is apparent that the thermal expansion of Si is the smallest, SiC is intermediate, and all of the others are larger. The thermal expansion of Mo and W is also reviewed in order to determine how well these metals match the thermal expansion of the adam… Show more

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Cited by 719 publications
(288 citation statements)
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“…These cracks originate from stresses built up during cooling as a result of the difference in thermal expansion coefficient between the (001) diamond substrate and the GaN with b ¼ 1Â10 À6 K À1 and b ¼ 6:2Â10 À6 K À1 ; respectively. [33][34][35] The presence of the cracks in the layer also results from the increased coalescence of the GaN islands because cracks can only occur if the stress is built up over large areas. With no coalescence, the stresses are local, and the GaN islands can cope with them.…”
Section: Growth Temperaturementioning
confidence: 99%
“…These cracks originate from stresses built up during cooling as a result of the difference in thermal expansion coefficient between the (001) diamond substrate and the GaN with b ¼ 1Â10 À6 K À1 and b ¼ 6:2Â10 À6 K À1 ; respectively. [33][34][35] The presence of the cracks in the layer also results from the increased coalescence of the GaN islands because cracks can only occur if the stress is built up over large areas. With no coalescence, the stresses are local, and the GaN islands can cope with them.…”
Section: Growth Temperaturementioning
confidence: 99%
“…Data from some sources reported as values of instantaneous volumetric COTE have been used in this study, by utilising this approximate relation. The rate of dilation of ceramics with respect to temperature is relatively independent of porosity, allowing thermal expansion coefficients to be calculated from lattice parameter measurements [211], with only slight error resulting from defects in the polycrystalline material [17]. The thermal expansion coefficient of non-cubic crystals is typically anisotropic [210], resulting in change in both shape (deformation) and volume (dilation) when heated [99].…”
Section: Thermal Expansion Coefficientmentioning
confidence: 99%
“…The data of Munro [10] is for the mean CTE, so this has been converted to instantaneous CTE values. For aluminium nitride and for beryllia the data presented by Slack & Bartram [17], not included in the preceeding work by the current authors [1], are considered the most reliable are used as the recommended curve. The regression coefficients in Table 4 for aluminium nitride and beryllia are for a curve fit of these data.…”
Section: Coefficient Of Thermal Expansionmentioning
confidence: 99%
“…Fourth-degree polynomials, Equation 15 are used for both properties. For fitting sialon, the following function was found to provide a fit with a lower SEE than either Equation 16 or Equation 17, and was thus used:…”
Section: Thermal Conductivitymentioning
confidence: 99%