2010
DOI: 10.1016/j.jallcom.2010.01.002
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Thermal expansion coefficient and dielectric properties of non-stoichiometric cordierite compositions with excess MgO mole ratio synthesized from mainly kaolin and talc by the glass crystallization method

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Cited by 30 publications
(12 citation statements)
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References 39 publications
(53 reference statements)
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“…The dielectric losses of the glass-ceramics in this article are higher than that of glass-ceramics prepared from high-purity raw materials [1]. However, the dielectric losses of some glass-ceramics are lower than the reported glass-ceramics from other natural raw materials [36]. The dielectric loss comes from two aspects: intrinsic and extrinsic.…”
Section: Resultsmentioning
confidence: 61%
“…The dielectric losses of the glass-ceramics in this article are higher than that of glass-ceramics prepared from high-purity raw materials [1]. However, the dielectric losses of some glass-ceramics are lower than the reported glass-ceramics from other natural raw materials [36]. The dielectric loss comes from two aspects: intrinsic and extrinsic.…”
Section: Resultsmentioning
confidence: 61%
“…Although samples A6 and A7 have lower crystallization temperature compared with A3, A4, and A5, but the forsterite phase was crystallized during sintering at 900°C for 2 h in these compositions, and consequently increased the dielectric constant value. It has been reported in a previous paper 28 that the dielectric constant of these samples was 5.97 and 6.14, which was higher than the standard range of dielectric constant reported for dense and high‐purity α‐cordierite 5,6 . This caused the densification process to end at lower temperature, thus crystallization before densification has resulted in higher porosity and higher dielectric constant 28 …”
Section: Resultsmentioning
confidence: 65%
“…These results were attributed to the increase in the amount of latex in ELH mixing sequences. Banjuraizah et al, 2010, stated that a material with a low dielectric constant has a great advantage to be used in high speed integrated circuit substrate since a low dielectric constant will increase signal transmission speeds by decreasing the propagation delay [20].…”
Section: Flexural Propertiesmentioning
confidence: 99%