2017
DOI: 10.1016/j.matdes.2017.06.061
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Thermal expansion behavior of copper matrix composite containing negative thermal expansion PbTiO 3 particles

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Cited by 33 publications
(10 citation statements)
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“…Generally speaking, coefficient of thermal expansion (CTE) of epoxy resins is much larger than CTE of Hastelloy C276 ® , usually used as a substrate of CC tapes, and their thermal conductivity is very low. As reported in [24][25][26], the mismatch in the thermal expansion could be reduced to reasonable value using an addition of filler material with very low (or even negative) CTE. This concept has simultaneously an advantage in enhancement of thermal conductivity [23][24][25][26][27][28][29].…”
Section: Introductionmentioning
confidence: 72%
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“…Generally speaking, coefficient of thermal expansion (CTE) of epoxy resins is much larger than CTE of Hastelloy C276 ® , usually used as a substrate of CC tapes, and their thermal conductivity is very low. As reported in [24][25][26], the mismatch in the thermal expansion could be reduced to reasonable value using an addition of filler material with very low (or even negative) CTE. This concept has simultaneously an advantage in enhancement of thermal conductivity [23][24][25][26][27][28][29].…”
Section: Introductionmentioning
confidence: 72%
“…The samples were prepared from two component epoxy resins mixed with a SiC powder filler with various resin to SiC ratios. The selection of the SiC filler is based on the results described in [26]. The powder contains particles with of 200-450 mesh, as declared by the producer; we verified by scanning electron microscope that the particle diameter ranges from 3 µm to 100 µm.…”
Section: Methodsmentioning
confidence: 95%
“…A more promising approach to lower the braze CTE is to introduce a negative thermal expansion (NTE) filler material, which contracts upon heating [32][33][34][35][36][37][38]. A practically important NTE material is LiAlSiO 4 , which has an anisotropic CTE (α a = 8.21 × 10 -6 K -1 and α c = -17.6 × 10 -6 K -1 , 0-1000 °C).…”
Section: Introductionmentioning
confidence: 99%
“…The coefficients of thermal expansion (CTE) of materials like SiC, SiO 2 , PbTiO 3 , ZrW 2 O 8 or diamond have low or even negative value (Table 1). According to several papers reported in [8][9][10][11][12], their addition in the form of powder to various materials had successfully reduced the thermal expansion of a final composite. This concept has also another advantage; the use of an insulating binder keeps unreduced the conductor resistivity in resistive, nonsuperconducting state.…”
Section: Introductionmentioning
confidence: 99%