Thermal expansion and elastic properties of high gold-Tin Alloys

Yost, F.G.; Karnowsky, M. M.; Drotning, W. D.; Gieske, J.H.

doi:10.1007/bf02647236

Cited by 44 publications

(25 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The 20 wt.% Sn eutectic has a eutectic temperature at 278 C, and has two solid phases z and d (AuSn) with the melting temperature at 519 C and 419 C, respectively. The z phase exhibits a hexagonal structure and has an elastic modulus and hardness similar to those of Au [27]. The z 0 phase is a line compound (Au 5 Sn) and exhibits a hexagonal structure.…”

Section: Introductionmentioning

confidence: 92%

Au–Sn bonding material for the assembly of power integrated circuit module

Zhu

Liao

et al. 2016

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 92%

Au–Sn bonding material for the assembly of power integrated circuit module

Zhu

Liao

et al. 2016

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…Brittle fracture, which occurred within the LD and Ti/Pt/Au metallization layers remaining on the heatsink, unequivocally demonstrated that the solder joint had good mechanical properties. This was attributed to the high mechanical strength of the Au/Sn solder 17,18 and the strong adhesion properties of the Ti/Pt/Au metallization. 19 LDs bonded in this region could achieve an optical output of 150-160 mW.…”

Section: Optimal Bonding Windowmentioning

confidence: 96%

Influence of Bonding Temperature and Applied Load on the Bonding Integrity and Optical Performance of Face-Down Bonded Ridge-Waveguide Lasers

Teo

Wang

Shi

et al. 2007

Journal of Elec Materi

View full text Add to dashboard Cite

The effects of bonding temperature and applied load on the mechanical integrity of 80Au-20Sn solder joints and the optical performance of laser diodes (LDs) are presented. Insufficient solder wetting at 280°C and poor joint integrity at an applied load below 0.196 MPa resulted in solder failure during die shear test. As the bonding temperature and applied load increased, the joint integrity and the optical performance improved. Shear testing further showed fracture in the LD due to the high mechanical strength of 80Au-20Sn solder and good adhesion properties of the solder joint. Microstructure studies showed good metallurgical stability with little interfacial intermetallic compound (IMC) formed. However, beyond an applied load of 0.523 MPa, the LD performances degraded due to modification of the bandgap energy in the active region. From our experimentation, a bonding window with good bonding integrity and high optical performance was, nevertheless, achieved.

show abstract

“…Nevertheless, there is no good agreement in the experimentally obtained YoungÕs modulus values, [6][7][8] Table I; for example, the modulus of AuSn measured using the ultrasonic technique with cast samples after annealing is 71 GPa, 6 whereas the value determined by microindentation testing on electrochemically deposited intermetallics is up to 101 GPa. 7 Moreover, the miniaturization of microelectronic packages requires the use of finer solder joints; as the solder joints become increasingly small (less than 100 lm in diameter) and contain only a few grains, their mechanical properties, however, cannot be determined from conventional mechanical tests as with bulk samples, and there may be a considerable variation in mechanical behavior from joint to joint because of the anisotropy of mechanical properties.…”

Section: Introductionmentioning

confidence: 92%

“…2 Although the vast majority of research [1][2][3][4][5] has focused on the microstructure of the solder and on its evolution during interfacial reaction between the solder and a pad to bridge the gap between the microstructure and mechanical property of the solder joints, surprisingly few studies of the mechanical properties of these Au-Sn compounds themselves exist in the literature. [6][7][8] This is attributable mainly to the difficulty in preparing the single-phase samples and the limitations of the available experimental techniques.…”

Section: Introductionmentioning

confidence: 98%

Determination of the Elastic Properties of Au5Sn and AuSn from Ab Initio Calculations

Wang

Tian

2008

Journal of Elec Materi

View full text Add to dashboard Cite

Elastic constants of single-crystal Au 5 Sn and AuSn were determined through ab initio calculations to characterize their polycrystalline elastic behavior and elastic anisotropy. The ideal bulk (K = 127 GPa), shear (G = 28 GPa), and YoungÕs modulus (E = 78 GPa), as well as PoissonÕs ratio (v = 0.398), of Au 5 Sn were determined using the Voigt-Reuss-Hill method and were very close to the range of experimental results; the values of AuSn were 88 GPa, 15 GPa, 42 GPa, and 0.420, but its ideal YoungÕs modulus was much smaller than the experimentally obtained values. This unusual discrepancy in the YoungÕs modulus of AuSn is probably attributed to its extraordinarily high anisotropy in YoungÕs modulus, with a 95 GPa difference between its maximum and minimum values. Au 5 Sn exhibits relatively low anisotropy in YoungÕs modulus with a maximum-minimum difference of 38 GPa.

show abstract

Thermal expansion and elastic properties of high gold-Tin Alloys

Cited by 44 publications

References 1 publication

Au–Sn bonding material for the assembly of power integrated circuit module

Au–Sn bonding material for the assembly of power integrated circuit module

Influence of Bonding Temperature and Applied Load on the Bonding Integrity and Optical Performance of Face-Down Bonded Ridge-Waveguide Lasers

Determination of the Elastic Properties of Au5Sn and AuSn from Ab Initio Calculations

Contact Info

Product

Resources

About