Thermal evaluation of partially molded 2.5D package with pin fin heat sink cooling

Zhang, H.Y.; Wang, Z.Q.; Lin, Tingyu

doi:10.1109/icept.2016.7583176

Cited by 3 publications

(3 citation statements)

References 11 publications

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“…First, high- performance chips are laterally placed close to each other while their temperature-sensitivity and mechanical-reliability metrics are different. This is a common scenario in 2.5D package platforms [28,46,79,[82][83][84][85][86][87][88][89][90][91][92][93]. Second, high-performance chips are vertically stacked, while the thermal resistance increases with the number of stacked chips.…”

Section: Thermal Management Challenges In Heterogeneousmentioning

confidence: 99%

“…This requires effective cooling very close to the heat source. However, some of the 2.5D packages have various layers, such as TIM and heat slug layers, between the heat source and the heat sink for reliability concerns at the board level [83,85,89,92]. When the heat sink has a rough contact surface and the 2.5D package has a large thermally induced or assembly warpage, the possibility of the active device cracking and failure increases after the heat sink is attached.…”

Section: Thermal Management Challenges Due To Multichipmentioning

confidence: 99%

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Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

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Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects are important, as trends of electronics packaging toward higher power, higher density, and 2.5D/3D integration are making thermal management even more challenging. While conventional cooling solutions based on large thermal-conductivity materials as well as heat pipes and heat exchangers may dissipate the heat from a source to a sink in a uniform manner, thermal metamaterials could help dissipate the heat in a deterministic manner and avoid thermal crosstalk and local hot spots. This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated packaging challenges, this paper also discusses the implications of thermal metamaterials for the future of electronic packaging thermal management. Thermal metamaterials could provide a solution to nontrivial thermal management challenges. Future research will need to take on the new challenges in implementing the thermal metamaterial designs in high-performance heterogeneous packages to continue to advance the state-of-the-art in electronics packaging.

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Section: Thermal Management Challenges In Heterogeneousmentioning

confidence: 99%

Section: Thermal Management Challenges Due To Multichipmentioning

confidence: 99%

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

View full text Add to dashboard Cite

show abstract

“…As shown in Figure 1 a, a Teflon-based thermal PCB was designed for packaging the chip to ensure efficient heat dissipation by incorporating optimized thermal vias in the design [ 10 ]. Research for work for the thermal enhancements of 2.5D is done by bridging the thermal path from the die to the top heat sink directly without molding material [ 11 ] as depicted in Figure 1 b. The other work used a new photo-imageable solder resist (PSR) that has high thermal conductivity to reduce the junction temperature of the chip [ 12 ].…”

Section: Introductionmentioning

confidence: 99%

Novel Heat-Mitigating Chip-on-Probe for Brain Stimulation Behavior Experiments

2020

Sensors

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This paper proposes a novel design for a chip-on-probe with the aim of overcoming the heat dissipation effect during brain stimulations using modulated microwave signals. The temperature of the stimulus chip during normal operation is generally 40 °C–60 °C, which is sufficient to cause unintended temperature effects during stimulation. This effect is particularly fatal in brain stimulation applications that require repeated stimulation. This paper proposes, for the first time, a topology that vertically separates the stimulus chip generating the stimulus signal and the probe delivering the signal into the brain to suppress the heat transfer while simultaneously minimizing the radio frequency (RF) transmission loss. As the proposed chip-on-probe should be attached to the head of a small animal, an auxiliary board with a heat sink was carefully designed considering the weight that does not affect the behavior experiment. When the transition structures are properly designed, a heat sink can be mounted to maximize the cooling effect, reducing the temperature by more than 13 °C in a simulation when the heat generated by the chip is transferred to the brain, while the transition from the chip to the probe experiences a loss of 1.2 dB. Finally, the effectiveness of the proposed design is demonstrated by fabricating a chip with the 0.28 μm silicon-on-insulator (SOI) complementary metal–oxide–semiconductor (CMOS) process and a probe with a RT6010 printed-circuit board (PCB), showing a temperature reduction of 49.8 °C with a maximum output power of 11 dBm. In the proposed chip-on-probe device, the temperature formed in the area in contact with the brain is measured at 31.1 °C.

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Thermal Characterization of 2.5D FCBGA for GPU Application

Chen

Huang

2020

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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Thermal evaluation of partially molded 2.5D package with pin fin heat sink cooling

Cited by 3 publications

References 11 publications

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Novel Heat-Mitigating Chip-on-Probe for Brain Stimulation Behavior Experiments

Thermal Characterization of 2.5D FCBGA for GPU Application

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