Thermal Design of Electronic Equipment

Remsburg, Ralph

doi:10.1201/9781420042368

Cited by 53 publications

(10 citation statements)

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“…where ∆P im and ∆P om are the pressure loss at the inlet/outlet manifolds due to the cross-sectional area change, while ∆P c and ∆P e are pressure loss caused by the abrupt contraction and expansion at the inlet/outlet of microchannel, respectively. ∆P im , ∆P om , ∆P c and ∆P e could be obtained according to the following equations [19,20]:…”

Section: Hydraulic Performancementioning

confidence: 99%

Experimental Investigation of the Flow and Heat Transfer Characteristics in Microchannel Heat Exchangers with Reentrant Cavities

Huang

2020

Micromachines

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The application of microchannel heat exchangers is of great significance in industrial fields due to their advantages of miniaturized scale, large surface-area-to-volume ratio, and high heat transfer rate. In this study, microchannel heat exchangers with and without fan-shaped reentrant cavities were designed and manufactured, and experiments were conducted to investigate the flow and heat-transfer characteristics. The impact rising from the radius of reentrant cavities, as well as the Reynolds number on the heat transfer and the pressure drop, is also analyzed. The results indicate that, compared with straight microchannels, microchannels with reentrant cavities could enhance the heat transfer and, more importantly, reduce the pressure drop at the same time. For the ranges of parameters studied, increasing the radius of reentrant cavities could augment the effect of pressure-drop reduction, while the corresponding variation of heat transfer is complicated. It is considered that adding reentrant cavities in microchannel heat exchangers is an ideal approach to improve performance.

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Section: Hydraulic Performancementioning

confidence: 99%

Experimental Investigation of the Flow and Heat Transfer Characteristics in Microchannel Heat Exchangers with Reentrant Cavities

Huang

2020

Micromachines

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“…The junction temperature is important to find thermal resistivity and conductivity, which is finalized the output current in output node at maximum temperature. According to Remsburg (2001), the layout temperature is varying with feature size corresponding 100-120°C. In BSIM4 analysis, temperature varied from -40-120°C.…”

Section: Thermal Effect In Cordic Cellmentioning

confidence: 99%

Low Energy, Improved Speed and High Throughput CORDIC Cell to Improve Performance of Robots’ Processor

Velrajkuma¹,

Senthilpar²,

Murthy³

et al. 2015

Asian J. of Scientific Research

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Robots are used in various real-time applications. The speed constraint in robotic system applications requires a real-time interface operation; this is a recent target in robotic research. The cost and size of a robotic system is often determined by hardware-based solutions. The coordinate Rotation Digital Computer (CORDIC) technique allows for an efficient execution of functions, such as inverse tangents and vector rotations, in the hardware. The CORDIC algorithm is very well suited for VLSI implementation due to the simplicity of the involved operations. This study proposed a full-adder based bit parallel iterative CORDIC circuit to improve the performance of robots' processor. The proposed full-adder and CORDIC circuit are designed and their layouts are generated by VLSI CAD tool. The parametric analysis is done using by BSIM4 analyzer. The output parameters such as propagation delay, area and power dissipation are calculated from simulated results of CORDIC cell. The proposed adder based CORDIC circuit designed for low energy, improved speed, low EPI and high throughput. The simulated result of proposed adder based CORDIC circuit is compared with other published CORDIC circuits. From the analysis of these simulated results, it was found that proposed adder based CORDIC circuit gives better performance in terms of power, propagation delay, speed, EPI and throughput than other published results. The results are extended to analysis of temperature coefficient, thermal conductivity and thermal flux for CORDIC cells' chip. The proposed circuit gives better tolerance of temperature and less leakage current than other adder based CORDIC cell.

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“…Self‐heating effect as the major problem of HEMTs, not only imposes constraints on electrical performances and linearity but it degrades the device lifetime . Consequently, these kinds of transistors require sophisticated thermal management to improve the output power …”

Section: Introductionmentioning

confidence: 99%

“…4 Consequently, these kinds of transistors require sophisticated thermal management to improve the output power. [5][6][7] There are two popular ways to assemble a discrete HEMT on a carrier: wire bonding and flip-chip. The conventional wire-bonding is more common; however, it suffers from several shortcomings such as the wire inductance effects, discontinuities, nonreproducible wire-bonds, and low reliability of interconnects due to the thermo-mechanical stress.…”

Section: Introductionmentioning

confidence: 99%

Thermal analysis of microwave GaN-HEMTs in conventional and flip-chip assemblies

Feghhi

Joodaki

2018

Int J RF Microw Comput Aided Eng

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Temperature rising which originates from self‐heating degrades the electrical characteristics, reliability, and lifetime of high‐power GaN‐HEMTs. In this article, a systematic analytical approach for thermal evaluation of microwave GaN‐HEMTs is constructed through combining and scrutinizing some of the basic static thermal analysis methods to provide a deeper insight into the process of the channel temperature rising and self‐heating with a much lower computational burden. The proposed systematic thermal analysis has been applied to two different assembly methods: conventional mounting and flip‐chip mounting. Although the mathematical and empirical equations used are simple enough to save time, the effects of several phenomena and different conditions on the channel temperature have been taken into account. These include heat crowding phenomenon, the effect of temperature‐dependent thermal conductivity of the transistor constituent materials, transistor geometry, die‐attach material properties, and bump dimensions. To validate the accuracy of the calculations, all the analytical analyses are followed by 3D thermal simulations in ANSYS software. The simulation results confirm the accuracy of the analytical calculations.

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Thermal Design of Electronic Equipment

Cited by 53 publications

References 0 publications

Experimental Investigation of the Flow and Heat Transfer Characteristics in Microchannel Heat Exchangers with Reentrant Cavities

Experimental Investigation of the Flow and Heat Transfer Characteristics in Microchannel Heat Exchangers with Reentrant Cavities

Low Energy, Improved Speed and High Throughput CORDIC Cell to Improve Performance of Robots’ Processor

Thermal analysis of microwave GaN-HEMTs in conventional and flip-chip assemblies

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