2013
DOI: 10.1134/s1066362213040115
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Thermal decomposition of CH3 131I in a gas flow

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Cited by 4 publications
(9 citation statements)
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“…At lower temperatures, the degree of CH 3 131 I decomposition was considerably lower: 13% at 500°C and 83% at 600°С. As we showed in [2], performing the thermal decomposition of CH 3 131 I in the presence of composite materials based on KSKG silica gel containing d elements allows the decomposition temperature to be significantly decreased. Under comparable experimental conditions, the degree of CH 3 131 I decomposition as high as 97-99% is reached at 465 ± 20°С in the presence of a composite material based on KSKG impregnated with compounds of Ni or its mixture with Cu in an amount of 8-10 wt %.…”
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confidence: 73%
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“…At lower temperatures, the degree of CH 3 131 I decomposition was considerably lower: 13% at 500°C and 83% at 600°С. As we showed in [2], performing the thermal decomposition of CH 3 131 I in the presence of composite materials based on KSKG silica gel containing d elements allows the decomposition temperature to be significantly decreased. Under comparable experimental conditions, the degree of CH 3 131 I decomposition as high as 97-99% is reached at 465 ± 20°С in the presence of a composite material based on KSKG impregnated with compounds of Ni or its mixture with Cu in an amount of 8-10 wt %.…”
mentioning
confidence: 73%
“…I (10 mg) in an air flow in the presence of composite materials KKM-Ni-NH 3 (water vapor-air flow temperature ~23°С, linear velocity of air 4.0-6.0 cm s -1 , water vapor content of the flow ~3-4 vol %, contact time 0.7-0.9 s, Т composite 350 ± 15°С, weight of the composite 10 g, granule size 1.0-3.0 mm, material bed height 4.8 cm, S column ~3.0 cm 2 As we showed in [2], CH 3 131 I is not taken up by the KSKG-based sorbents containing compounds of d elements (Ni, Cu). The main 131 I species localized on these materials is I 2 , which is formed via thermal decomposition of CH 3 131 I.…”
Section: Resultsmentioning
confidence: 99%
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