Thermal Cycle/Aging Reliability of Lead Free 0201 Assemblies

Ghaffarian, Reza; Ramkumar, S. Manian; Varanasi, Arun

doi:10.1109/ectc.2006.1645927

Cited by 5 publications

(1 citation statement)

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“…K. Hirasawa et al, [7]also published their studies to optimize the process parameters and also tried to evaluate the strength of the 0201 components for eutectic assembly by performing shear tests. R. Ghaffarian et al, [8] also published shear test results comparing the thermal cycling and aging tests for 0201 components. He concludes that aging test may be more appropriate for this component.…”

Section: Introductionmentioning

confidence: 95%

Comprehensive Assembly and Reliability Study of 0201's for High Reliability Applications for Utilizing both a Pb-Free and Sn/Pb Assembly Process

Ramakrishna¹,

Nandagopal²,

Dick³

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

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A comprehensive study was undertaken to evaluate various board design parameters, assembly and reliability of 0201's as it relates to high reliability products. The design parameters considered included four pad designs, two trace width terminations, three orientations, three board thicknesses and four component to component spacing on a large PWB panel. The assembly parameter evaluation included, SnPb and Pb-free solder pastes for board assembly, which were built at four different board assembly locations. The reliability testing included ATC, shear and mechanical shock testing. The purpose of this study was to evaluate the design space that will result in high assembly process yield and high solder joint reliability. A 0402 control leg was included in the design for comparison.About 400,000 of the 0201 components were assembled for this study. The assembly and design parameters were evaluated on all three board thicknesses (62 mils, 93 and 126 mils). Among the four pad designs two of the designs were intended for under the BGA placement (via to via). Among the remaining four pad designs, two of them showed better assembly process yields than the rest. Within the design space considered, no significant trends in assembly yield were observed due to trace terminations, component to component spacing and board thicknesses.For the reliability testing the boards were temperature cycled between 0-100°C per IPC9701. Shear testing was performed prior to and after the temperature cycling testing to observe any deterioration in the solder joint reliability for any of the pad designs considered. Mechanical shock testing at 340G's 1.6ms input pulse was also conducted for the different design parameters.

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Section: Introductionmentioning

confidence: 95%

Comprehensive Assembly and Reliability Study of 0201's for High Reliability Applications for Utilizing both a Pb-Free and Sn/Pb Assembly Process

Ramakrishna¹,

Nandagopal²,

Dick³

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

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Optimization of lead free solder 01005 component assembly

Liu

Johnson

2007

Soldering &Amp; Surface Mount Technology

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -To optimize the printed circuit board design and assembly processes to minimize defects in the assembly of 01005 size chip resistors. Design/methodology/approach -A test board was designed with a range of pad sizes, pad shapes, pad spacings and pad orientations. This test board was used in a series of designed experiments to optimize the printing, placement and reflow processes. Assembly defects were analyzed as a function of board design and assembly processes. Findings -An electroformed, 76 mm stencil yielded a robust paste printing process and higher process capability indices (C p ) compared to a 102 mm stencil. Nitrogen reflow was required to achieve good solder wetting due to the high surface-to-volume ratio of the solder deposits. With regard to bridging defects, no defects were observed if the pad-to-pad spacing for parallel resistors was 150 mm or larger. Rectangular pads with no vias-in-pad and designed at 90 percent of nominal pad size (pad size type 2) with the ramp profile, independent of 08 or 908 resistor orientation yielded the lowest number of defects. Given the undersized pads on the actual board, the 90 percent pad average width was 170 mm (versus a design value of 183 mm) and the measured width of the 01005 chip resistor was 180 mm. Thermal cycle reliability testing of the solder joints with this pad size showed no failures after 1,000 thermal cycles. Originality/value -The results of this work provide a set of design and assembly processes recommendations for those who must implement 01005 size component assembly in production.

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